Find the right Training program to boost your Semiconductor expertise
Welcome to the Training Catalog of the European Network of Chip Competence Centres
Explores memristive technologies from materials and device modeling to neuromorphic architectures and AI accelerator design.
Learn how a quantum computer could be physically build, and how it could be controlled.
Introduction to multiphysics simulation of electronic and power devices using COMSOL Multiphysics. The course covers electrical, thermal and mechanical modelling, coupled electro-thermo-mechanical simulations, model setup, boundary conditions, meshing, and interpretation of simulation results.
Provides theoretical and practical training in sinusoidal circuit analysis, simulation, experimentation, and electrical measurements.
Develops competencies in DC and AC circuit analysis, measurement techniques, equivalent circuits, power analysis, and frequency response for electrical engineering applications.
Trains professionals to analyze, test, and evaluate semiconductor materials and devices under extreme operating conditions using physics, materials science, and reliability concepts.
Develops practical skills in measuring, analyzing, and characterizing microwave devices and antennas used in telecommunications and high-frequency systems.
IEEE COINS is an international conference that brings together researchers, academics, and industry leaders to discuss the latest advancements in intelligent systems, artificial intelligence, computing, networking, robotics, and their real-world applications.
This course is intended for participants interested in RF techniques applied to FD-SOI technologies. It combines lectures and labs to allow participants getting skills (knowledge and know-how)
This short course on FD-SOI technology is intended for experienced chip designers, technologists and newcomers to the field. Led by industry experts, it will provide a comprehensive overview of FD-SOI technology and its benefits, addressing multiple aspects of circuit design.
You will gain a solid foundation in the theory behind PICs, understand the practical aspects of design and fabrication, and explore real-world applications of photonic chips while fabricating and testing your own PIC. You will receive an official certificate from UGent for this training.
Covers the complete workflow of multilayer optical filters, from design and simulation to fabrication and characterization.
Introduces semiconductor materials, characterization techniques, and applications in electronics and optoelectronics.
Introduces advanced optical phenomena including diffraction, interference, polarization, nonlinear optics, lasers, and holography.
Provides broad training in optics, optoelectronics, optical systems, communications, sensing, and device integration.
Covers optical instruments, sensors, imaging systems, radiometry, photometry, simulation, and practical optical applications.
Provides advanced knowledge of modern optics, optical communications, waveguides, free-space communications, and quantum key distribution.
Develops skills in RF and microwave measurements using VNAs and other instrumentation for device and antenna characterization.
Introduces laser principles, industrial applications, safety aspects, and emerging developments in laser technologies.
Covers digital IC frontend design, including HDL coding, RTL design, synthesis, optimization, timing analysis, and advanced design methodologies.
Covers thin-film deposition technologies and micro/nanostructured materials for functionalization and advanced material applications.
Provides theoretical and practical training for operating in cleanroom environments used in semiconductor, optoelectronics, medical, and research applications.
Participants will explore the design and fabrication of PCBs and printed board assembly, with a strong focus on Reliability, Signal Integrity, Power Integrity, EMC and EMI. The program combines both theory and hands-on lab sessions where participants can perform their own measurements.
An introduction to digital hardware design using VHDL. The course provides a practical introduction to the design of digital systems, starting from the fundamental concepts of combinational and sequential logic and progressing towards the description, simulation, and analysis of digital hardware.
The course covers the key aspects of spherical and aspherical optical lenses and mirrors and highlights the unique advantages of freeform optical surfaces. Prototyping, manufacturing and optical testing are illustrated with demonstrations, and hands-on experience is provided.
Know how to read and understand component datasheets Understand the challenges associated with GaN and SiC components Learn about the main topologies: buck, boost, inverter, and converters, including LLC-type DC/DC converters Be able to specify a power converter
Understand the challenges associated with GaN and SiC components and explore the application sectors and key topologies that benefit from them.
Covers the complete IC testing workflow from design-for-test to packaging, PCB development, analog/digital testing, and automation.
Introduces wafer processing, chip handling, packaging, assembly, and electrical interconnection techniques for semiconductor devices.
In this course, instructors from KU Leuven introduce you to chip design. The course gives a broad view starting from the materials and processes that are used for chip fabrication over circuits made of transistors towards chips for AI. The course offers theoretical and hands-on sessions.
Covers the principles, design, simulation, and characterization of integrated optical devices and photonic systems.
Brings together experts to discuss lithography technologies, processing challenges, equipment advances, and emerging developments.
Intensive hands-on training in AMS layout design using advanced CMOS technologies, with applications in automotive, IoT, and communications.
Intensive hands-on training in physical IC design, including floorplanning, placement, routing, clock-tree synthesis, and physical verification using industry EDA tools.
Instructors from multiple companies in the chip industry will learn you all about the layout of analog chips. The course offers theoretical sessions, and there will be a strong focus on hands-on training and real-life examples.
Course introduces the principles, advantages, limitations, and applications of laser lithography. It includes hands-on laser patterning of photoresist. By the end, students will be able to independently perform laser lithography.
Hands-on training in nanofabrication, covering sample preparation, CAD design, lithography, thin-film deposition, device processing, characterization (optical, SEM, AFM) and electrical testing. Includes work in controlled environments such as gloveboxes and vacuum systems.
Course will provide training in advanced fabrication of hybrid devices, which includes stacked heterostructure devices and superconducting/2D material devices. Fabrication will be performed in an inert atmosphere (i.e. glovebox), and measurements will be performed in a cryogenic chamber
Course will provide basic knowledge on the novel type of cryomemory based on resistance switching in a correlated 2D material, showcasing its advanced characteristic. Course includes hands-on measurements at cryogenic temperatures.
Course will provide training in sample preparation, cryogenic and vacuum system handling, and transport measurements at cryogenic temperatures. Course will cover basic 2-point and 4-point resistance measurements as well as advanced magnetoresistance measurements.
Course will provide training in fabrication of superconducting Josephson junction devices, which are the main building blocks of superconducting quantum processors, travelling wave parametric amplifiers, SFQ logic circuits and more.
Course will provide training in fabrication of superconducting Josephson junction devices, which are the main building blocks of superconducting quantum processors, travelling wave parametric amplifiers, SFQ logic circuits and more.
We mainly deal with different power supplies and discuss their strengths and weaknesses, also with regard to electromagnetic compatibility. The main focus in this MOOC is therefore on the topics of linear voltage regulators, switched mode supplies and the basics of electromagnetic compatibility.
EMC is quite interdisciplinary and a challenging field. It is a subfield of electronics and communications engineering. Further, it is quite a practice-oriented subject, and in the beginning you are overwhelmed with a lot of technical terms. But don't worry: we will progress step by step.
Door middel van Mechanical simulations kun je het ontwerp van een machine(onderdeel) of product in een vroeg stadium beoordelen en optimaliseren. Doorgaans gebeurt dit met Finite Element Software (Eindige Elementen Methode).
People who don't have to design (specify, test, ...) optical systems but are working in projects with optics together with optical designers and want to know more about optical prinicples, will benefit from this application-oriented course.
A 5-day hands-on course on analog IC design, including schematic development, component sizing, verification across process, voltage, and temperature (PVT) variations, and layout design for fabrication.
The course covers advanced characterization and reliability testing of power semiconductor modules. Focus is placed on static/dynamic electrical measurements, thermal profiling, and failure mechanisms under stress.
A hands-on bare-metal course on the SiFive FE310-G002 RISC-V microcontroller (HiFive1), focused on interrupts, machine timers, and implementing a preemptive round-robin scheduler with full context switching in C and minimal RISC-V assembly.
Explores IC design for AIoT applications, covering SoCs, AI accelerators, edge computing, neuromorphic systems, and low-power hardware.
Five-day summer school on silicon photonics, covering the PIC technology chain from design and fabrication to characterisation, packaging, testing and applications.
This intensive program combines strong theoretical foundations with practical, hands-on IC design experience, offering a unique opportunity for students, researchers, and professionals working in microelectronics and semiconductor technologies.
Four-day workshop on the convergence of artificial intelligence and photonics, including machine learning, inverse design, optical computing and photonic hardware.
Learn the fundamentals of scanning electron microscopy (SEM) and focused ion beam (FIB) techniques. Explore applications such as cross-section analysis, defect inspection, contact deposition, structure etching, 3D tomography, e-beam lithography, and lamella preparation.
Introduce high-level digital circuit synthesis and optimization from algorithms in the C/C++ language. It covers digital design description in programming languages, hardware-specific libraries, and design techniques. Practical experiments environment: AMD Vitis HLS and AMD (Xilinx).
Analog and mixed-signal (A/MS) ICs require different testers than for digital ICs, as well as different DfT techniques. This course teaches the principles of practical A/MS DfT and test, and the imminent IEEE standards that facilitate systematic solutions now and eventually much more automation.
The PIC Design Course covers the theory and practice of integrated photonic components and circuit design using the powerful JePPIX building blocks. Layout and simulation methods are explored with JePPIX software partners and professional designers in hands-on sessions.
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.