Building a stronger European semiconductor ecosystem with the European Network of Chips Competence Centers
About aCCCess
aCCCess (Alliance of Chips Competence Centres for Enhanced Semiconductor Services) is a four-year Coordination and Support Action launched in March 2025 under the EU Chips Act. It aims to build a strong, interconnected European Network of Chips Competence Centres (ENCCC) that enables innovation, facilitates access to advanced semiconductor services, and strengthens Europe’s position in the global semiconductor value chain.
Network
Our network is comprised of Chip Competence Centers, Pilot lines and Design Platforms. Together, PLs and the DP empower the CCCs with cutting-edge infrastructure.
What is a Competence Center?
A Chips Competence Centre (CCC)is a hub of excellence providing access to specialised semiconductor knowledge, training, prototyping, testing, and small-scale production. These centres are pivotal to Europe's semiconductor strategy by:
- Supporting SMEs and start-ups with innovation services
- Bridging the gap between research and industry
- Promoting regional and pan-European know-how in chips and microelectronics
What is a Pilot Line & a Design Platform?
Pilot Lines (PLs) are advanced manufacturing facilities that help scale innovations from research to production, enabling validation in relevant environments.
The Design Platform (DP) is a cloud-based virtual environment providing state-of-the-art Electronic Design Automation (EDA) tools and design libraries to:
- Accelerate chip design and prototyping
- Enable collaboration across Europe
- Support education and skills development in semiconductor design
Latest News
Riga Chip Summit 2026: Strengthening Europes Semiconductor Ecosystem
On 13 May 2026, the Latvian Chip Competence Centre hosted the Riga Chip Summit 2026, the first-ever semiconductor-focused summit in Latvia. The event marked a significant milestone for the Baltic and European semiconductor landscape, bringing together over 200 participants from 23 countries, including industry leaders, researchers, startups, investors, policymakers, and...
Czech Semicon Days 2026
The Czech Semiconductor Centre took part in this years Czech Semicon Days 2026 as an expert partner of the international forum organised by CzechInvest. The event, held from 18 to 20 May in Prague, Brno and Usti nad Labem, connected Czech semiconductor expertise with leading European and global partners, investors,...
aCCCess Webinar Series Technology Offers #1
The first webinar of the aCCCess Webinar Series on Technology Offers featured the APECS Pilot Line, showcasing its advanced packaging and heterogeneous integration capabilities under the EU Chips Act. The session highlighted collaboration with the ChipNL Competence Centre and explored how joint efforts support innovation, industry uptake, and the strengthening...
Open Calls
APECS Open Access Call
Opens:Apr 01, 2026 00:00 CET
Closes:Jun 30, 2026 23:59 CET
The APECS Pilot Line launches it's first annual Open Access Calls!
As part of the APECS pilot lines broader access strategy, the annual Open Access Calls invite players across the semiconductor value chain to submit project ideas for selected pilot line technologies. The calls provide structured, guided, and transparent access to APECS modern R&D infrastructure, enabling companies, RTOs and universities to validate concepts, accelerate development, and collaborate directly with APECS experts.
Open Access to FAMES Pilot Line
Opens:Mar 09, 2026 00:00 CET
Closes:Dec 31, 2026 23:59 CET
The FAMES Pilot Line accepts Spontaneous User Requests year-round, offering organisations rapid access to its advanced semiconductor technologies outside the annual Open-Access Calls. This pathway enables time-critical projects to move forward without waiting for the next call.
XECS Call 6
Opens:Jun 02, 2026 00:00 CET
Closes:Jan 21, 2027 17:00 CET
Xecs is an Eureka Cluster specifically designed to accelerate the pace of sustainable industrial innovation in the Electronics Components & Systems (ECS) community. Xecs intends to create an ambitious international collaboration programme. The resulting RD&I projects will generate high societal and economic impact for all those who participate in an Xecs project.
Events
The 2026 IMAPS Nordic Microelectronics Packaging Conference and Exhibition (NordPac)
Jun 10, 2026 15:00 CETJun 10, 2026 17:00 CET
Kista Science TowerFarogatan 33, 164 51 Kista, Sweden
IMAPS Nordic welcomes you to the 2026 IMAPS Nordic Microelectronics Packaging Conference and Exhibition (NordPac) in Stockholm, Sweden. The event brings together academia and industry to explore the latest developments and future trends in microelectronics, packaging, and system integration. As part of the conference, APECS will host a dedicated workshop: **APECS Workshop...
Event hosted by
Silicon Saxony Days 2026
Jun 15, 2026 13:00 CESTJun 17, 2026 13:00 CEST
Dresden International AirportFlughafenstrasse 01099 Dresden
## Silicon Saxony Days With over 1.000 participants and more than 30 % international guests, Silicon Saxony Days is one of the most important international high-tech and networking events in Europe. It offers cross-industry insights into technologies and solutions in the areas of hardware, software and connectivity. Discover [Silicon Saxony...
Event hosted by
EPoSS Annual Forum 2026
Jun 16, 2026 12:00 GMTJun 19, 2026 13:00 GMT
INL International Iberian Nanotechnology LaboratoryAv. Mte. Jose Veiga s/n, 4715-330 Braga, Portugal
The EPoSS Annual Forum 2026 will take place from June 16-19 in Braga, Portugal, kindly co-hosted by the EPoSS member INL - International Iberian Nanotechnology Laboratory. The Annual Forum offers sessions with high-ranking representatives from the EU, local authorities, institutions and companies, thematic sessions, poster presentations, start-up award pitch and...
Event hosted by
Latest Trends
onsemi introduces Elite Pairing Studio to simplify pairing SiC MOSFETs and gate drivers for power electronics design
Online interactive simulation tool gives visibility into device-level behavior and pairing trade-offs
Atomera targets RF GaN on silicon - Industrial News
Atomera is targeting wider RF GaN adoption through silicon substrates. The company says its Mears Silicon Technology can reduce parasitic losses in GaN-on-silicon devices, supporting lower-cost RF routes for 5G, 6G, satellite, and high-frequency electronics.
European Commission: Chips, Cloud, Open Source and AI – EU Commission presents package on technological sovereignty - Silicon Saxony
June 3, 2026. The European Commission presented the "European Technological Sovereignty Package." It comprises two legislative proposals – the "Chips Act 2.0" and the Cloud and AI Development Act. The Commission also presented an open-source strategy and a strategic roadmap for digitalization and AI in the energy sector.
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.