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Latest News
aCCCess Webinar on Technology Offers #4
The latest edition of the aCCCess Webinar Series on Technology Offers brought together experts from PIXSpain and PIXEurope to explore how European initiatives are accelerating the development and industrialisation of Photonic Integrated Circuits (PICs)....
Chips Think Tank #8 - Rethinking Advanced Packaging for Strategic Markets
The latest edition of the aCCCess Chips Think Tank webinar series brought together semiconductor stakeholders to discuss how advanced packaging can support strategic markets where production volumes are limited but reliability requirements are exceptionally high....
aCCCess Webinar on Semiconductor Training Offers#2
As demand for skilled professionals in the semiconductor industry continues to grow, the aCCCess Webinar Series on Semiconductor Training Offers brought together participants from across Europe for its second edition, featuring the PIXSpain and POEMS Competence Centres....
Open Calls
Open Access to FAMES Pilot Line
Opens:Mar 09, 2026 00:00 CET
Closes:Dec 31, 2026 23:59 CET
The FAMES Pilot Line accepts Spontaneous User Requests year-round, offering organisations rapid access to its advanced semiconductor technologies outside the annual Open-Access Calls. This pathway enables time-critical projects to move forward without waiting for the next call.
XECS Call 6
Opens:Jun 02, 2026 00:00 CET
Closes:Jan 21, 2027 17:00 CET
Xecs is an Eureka Cluster specifically designed to accelerate the pace of sustainable industrial innovation in the Electronics Components & Systems (ECS) community. Xecs intends to create an ambitious international collaboration programme. The resulting RD&I projects will generate high societal and economic impact for all those who participate in an Xecs project.
INFRACHIP Open Call to Free Access to State-of-the-Art Technologies
INFRACHIP is a European project under Horizon Europe Programme, offering distributed research infrastructure as a wider European research platform for the sustainable development of next-generation and future semiconductor chips.
Events
The Technology Sovereignty Package in Practice
Nov 04, 2026 12:00 CETNov 05, 2026 14:30 CET
Le Plaza Hotel Boulevard Adolphe Maxlaan 118/126, 1000 Brussels, Belgium
Five months after the launch of the European Union's Technology Sovereignty Package, the European semiconductor ecosystem will come together once again to assess the first developments, exchange perspectives and shape the next steps of Europe's technological journey. Taking place on 4-5 November 2026 in Brussels (Le Plaza Hotel, Adolphe Maxlaan 118/126,...
Event hosted by
Chips Venture Forum 2026 Final Event
Nov 10, 2026 09:00 CETNov 13, 2026 18:00 CET
Munich (Germany)SEMICON
The 2026 edition of the Chips Venture Forum will introduce an enhanced format designed to maximize interactions with investors and increase visibility across the semiconductor ecosystem. The Chips Venture Forum will now unfold in two complementary stages: 1.Chips Venture Forum Selection at INPHO Venture Summit, in Bordeaux **(21-22 October 2026)** ...
Event hosted by
SEMICON Europa: ITF Chip into the Future
Nov 10, 2026 10:00 CETNov 10, 2026 12:00 CET
Messe MunchenMesse Munchen
Europe's next era: Navigating the perfect storm SEMICON Europa 2026 is co-located with electronica in Munich, Germany creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain. This year's theme centers on the increasingly interconnected relationship between technological innovation and...
Event hosted by
Latest Trends
Infineon: World's first high-volume production facility for gallium nitride power semiconductors on 300-millimeter wafers built in Europe - Silicon Saxony
October 27, 2026. Infineon Technologies AG is building the world's first high-volume production facility for the latest generation of gallium nitride (GaN) power semiconductors on 300-millimeter wafers. As part of the project, Infineon is investing approximately €1.1 billion in existing cleanroom space at its Villach site by 2034. The simultaneous use of existing and modernized infrastructure enables a particularly efficient and cost-effective expansion of production capacity. Production is scheduled to start at the end of 2027. With this investment, Infineon is addressing the rapidly growing demand for high-performance power supply solutions. Gallium nitride enables significant efficiency gains in numerous applications such as AI data centers, energy infrastructure, electromobility, robotics, and consumer electronics.
NXP: Volkswagen Group strengthens its strategic semiconductor ecosystem through partnership with NXP - Silicon Saxony
October 26, 2026. The Volkswagen Group and NXP Semiconductors announced today, ahead of the International Automotive Suppliers Fair (IZB) in Wolfsburg, that they have agreed on a strategic partnership. NXP's S32K5 family of microcontrollers (MCUs) will serve as a key component of the Volkswagen Group's future software-defined vehicle (SDV) architecture and will support zonal control across all brands and vehicle segments. The first vehicle with the new architecture is planned for 2027.
Technology: Infineon invests more than one billion euros in Austria
The DAX-listed company is building a new production line for energy-saving chips made from the innovative material gallium nitride. The subsidies are substantial.
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.