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How RIBER is expanding beyond III-V epitaxy to enable the next generation of photonic devices....

The Industrial Alliance for Semiconductors brings together Europes key microelectronics stakeholders through dedicated working groups addressing strategic challenges. One of these groups focuses on PFAS in semiconductor manufacturing, tackling the balance between environmental concerns and industrial needs. A new white paper outlines research priorities to support this transition....

The European Chips Act 2.0, presented on 3 June 2026, shifts the focus to demand for European chips. ChipNL CC reflects on what this means for the Dutch semiconductor ecosystem....

Opens:Jul 07, 2026 09:00 CET
Closes:Sep 30, 2026 17:00 CET
New Chips JU calls now open for applications, worth over 300 million in EU funding.
The calls span the two pillars of the programme: Electronic Components and Systems (ECS), which funds research and innovation projects, and the Chips for Europe Initiative, which funds capacity building and infrastructure.

Opens:Mar 09, 2026 00:00 CET
Closes:Dec 31, 2026 23:59 CET
The FAMES Pilot Line accepts Spontaneous User Requests year-round, offering organisations rapid access to its advanced semiconductor technologies outside the annual Open-Access Calls. This pathway enables time-critical projects to move forward without waiting for the next call.

Opens:Jun 02, 2026 00:00 CET
Closes:Jan 21, 2027 17:00 CET
Xecs is an Eureka Cluster specifically designed to accelerate the pace of sustainable industrial innovation in the Electronics Components & Systems (ECS) community. Xecs intends to create an ambitious international collaboration programme. The resulting RD&I projects will generate high societal and economic impact for all those who participate in an Xecs project.

Sep 07, 2026 10:00 CETSep 07, 2026 12:00 CET
Palma de MallorcaSpain
The premier European forum for sharing innovations in solid-state devices and circuitsESSERC provides an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. With the level of integration for system-on-chip design rapidly increasing, a deeper interaction among technologists, device experts, IC designers and...
Event hosted by

Sep 07, 2026 12:00 EESTSep 08, 2026 21:00 EEST
Dipoli Conference CentreOtakaari 24, 02150 Espoo, Finland
Are you ready to explore the vision for Europe's semiconductor and quantum future with leading players in chips and chip-based systems? [The Nordic Chip Summit 2026](https://lyyti.events/p/nordic_chip_summit_2026) will take place on 7-8 September 2026 in Espoo, Finland, bringing together top experts, decision-makers, and innovators from across Europe and beyond. ...
Event hosted by

Sep 07, 2026 14:00 CESTSep 07, 2026 17:30 CEST
AUDITORIUM PALMA DE MALLORCAAUDITORIUM PALMA DE MALLORCA, Av. Gabriel Roca, 18 | 07014 Palma - Illes Balears
The FAMES Pilot Line will participate in ESSERC 2026, taking place from 7 to 10 September 2026 in Palma de Mallorca, Spain. Recognised as one of Europes leading conferences on solid-state devices and circuits, ESSERC brings together researchers, technologists, device experts, IC designers and system architects to discuss the latest advances...
Event hosted by

STMicroelectronics and the National University of Singapore (NUS) officially launched the ST–NUS HELIX Corporate Lab on 24 August 2026. This is a four-year strategic research initiative focused on advancing the next generation of edge AI technologies. HELIX, which stands for Hardware for Embodied Low-power Intelligent Xcceleration, will enable new generative and embodied AI use cases at the edge through system-to-silicon innovation.

Following the Chips Act 2.0: The Berlin-based deeptech startup NextGO Epi receives 2 million euros for the production of the next generation of semiconductors.

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aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.