Building a stronger European semiconductor ecosystem with the European Network of Chips Competence Centres
About aCCCess
aCCCess (Alliance of Chips Competence Centres for Enhanced Semiconductor Services) is a four-year Coordination and Support Action launched in March 2025 under the EU Chips Act. It aims to build a strong, interconnected European Network of Chips Competence Centres (ENCCC) that enables innovation, facilitates access to advanced semiconductor services, and strengthens Europe’s position in the global semiconductor value chain.
Network
Our network is comprised of Chip Competence Centres, Pilot lines and Design Platforms. Together, PLs and the DP empower the CCCs with cutting-edge infrastructure.
What is a Competence Centre?
A Chips Competence Centre (CCC)is a hub of excellence providing access to specialised semiconductor knowledge, training, prototyping, testing, and small-scale production. These centres are pivotal to Europe's semiconductor strategy by:
- Supporting SMEs and start-ups with innovation services
- Bridging the gap between research and industry
- Promoting regional and pan-European know-how in chips and microelectronics
What is a Pilot Line & a Design Platform?
Pilot Lines (PLs) are advanced manufacturing facilities that help scale innovations from research to production, enabling validation in relevant environments.
The Design Platform (DP) is a cloud-based virtual environment providing state-of-the-art Electronic Design Automation (EDA) tools and design libraries to:
- Accelerate chip design and prototyping
- Enable collaboration across Europe
- Support education and skills development in semiconductor design
Latest News
Workshop on Integrated Photonics
As part 61st International Conference on Microelectronics, Devices and Materials , there is a workshops dedicated to a special topic are included to the programme of the MIDEM Conferences. During the workshop, invited speakers present papers on the chosen topics from different aspects within their special field, thus offering...
61st International Conference on Microelectronics, Devices and Materials
The 61st International Conference on MIcroelectronics, DEvices and Materials MIDEM 2026 continues the long-standing tradition of annual international conferences organized by the MIDEM Society. For decades, the conference has brought together leading Slovenian and international experts in the fields of microelectronics and materials research and innovation. Covering a broad field...
Chips Act 2.0: a shift towards demand for European chips
The European Chips Act 2.0, presented on 3 June 2026, shifts the focus to demand for European chips. ChipNL CC reflects on what this means for the Dutch semiconductor ecosystem....
Open Calls
CHIPS JU Calls: July 2026
Opens:Jul 07, 2026 09:00 CET
Closes:Sep 30, 2026 17:00 CET
New Chips JU calls now open for applications, worth over 300 million in EU funding.
The calls span the two pillars of the programme: Electronic Components and Systems (ECS), which funds research and innovation projects, and the Chips for Europe Initiative, which funds capacity building and infrastructure.
Open Access to FAMES Pilot Line
Opens:Mar 09, 2026 00:00 CET
Closes:Dec 31, 2026 23:59 CET
The FAMES Pilot Line accepts Spontaneous User Requests year-round, offering organisations rapid access to its advanced semiconductor technologies outside the annual Open-Access Calls. This pathway enables time-critical projects to move forward without waiting for the next call.
XECS Call 6
Opens:Jun 02, 2026 00:00 CET
Closes:Jan 21, 2027 17:00 CET
Xecs is an Eureka Cluster specifically designed to accelerate the pace of sustainable industrial innovation in the Electronics Components & Systems (ECS) community. Xecs intends to create an ambitious international collaboration programme. The resulting RD&I projects will generate high societal and economic impact for all those who participate in an Xecs project.
Events
Chips Think Tank Webinar#7: Building the Materials Platform for the Future of Integrated Photonics
Jul 30, 2026 12:00 CETJul 30, 2026 13:00 CET
Webinar
Integrated photonics is entering a new phase of development, driven by the demand for higher bandwidth, lower power consumption, and the emergence of new applications in AI infrastructure, quantum technologies, telecommunications and sensing. While silicon photonics has established itself as a key platform, the next generation of photonic devices will...
Event hosted by
ASIC Design Introduction: From Concept to Silicon
Aug 24, 2026 09:00 CESTAug 28, 2026 12:00 CEST
Imec, Leuven, Belgium
This course will provide a thorough introduction to the ASIC design and development flow, covering multiple aspects, such as basics of Digital and Analog Design, Packaging, Test, Chiplet Integration, and IP-related challenges. All sessions will be given by experts from imec. This course is aimed at students with a professional Bachelor's...
Event hosted by
ESSERC
Sep 07, 2026 10:00 CETSep 07, 2026 12:00 CET
Palma de MallorcaSpain
The premier European forum for sharing innovations in solid-state devices and circuitsESSERC provides an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. With the level of integration for system-on-chip design rapidly increasing, a deeper interaction among technologists, device experts, IC designers and...
Event hosted by
Latest Trends
TSMC Forecasts Robust, Long-Term AI Chip Demand Amid Arizona Expansion
Taiwan Semiconductor Manufacturing Company (TSMC) anticipates a sustained, vigorous demand for artificial intelligence (AI) chips over the coming years, coinciding with its escalation of investments in Arizona. The semiconductor giant's strategic move involves bolstering its presence in the United States through significant financial commitments. TSMC's decision aligns with the broader industry trend of focusing on AI technologies to cater to increasing global demand for advanced computing solutions.The company's proactive approach underscores the significance of AI chips in driving technological innovation and meeting evolving market needs. By expanding its operations in Arizona, TSMC aims to capitalize on the growing demand for cutting-edge semiconductor products. This expansion signifies TSMC's commitment to enhancing its manufacturing capabilities and staying at the forefront of AI chip development.TSMC's emphasis on AI chip production reflects the shifting dynamics in the semiconductor industry, with a notable pivot towards advanced technologies. The company's investment in Arizona not only strengthens its foothold in the U.S. market but also underscores its dedication to fostering innovation in the AI sector. As TSMC gears up to meet the anticipated surge in demand for AI chips, its strategic vision positions it as a key player in driving the next phase of technological advancement.Furthermore, TSMC's forward-looking investment strategy in Arizona is poised to have a transformative impact on the semiconductor landscape. The company's commitment to expanding its AI chip production capacity underscores its confidence in the sustained growth of the semiconductor market. With the global focus on AI technologies intensifying, TSMC's proactive stance sets the stage for continued advancements in the realm of cutting-edge computing solutions.
AI Data Centers Push Silicon Photonics Toward 300-mm Scale
AI data centers are torching copper’s reign as ST pushes 300-mm silicon photonics for faster, denser optical links.The post AI Data Centers Push Silicon Photonics Toward 300-mm Scale appeared first on EE Times.
Cambridge’s Silicon Microgravity secures €7.08 million to scale its GPS-free sensing and navigation tech | EU-Startups
Silicon Microgravity Limited (SMG), a Cambridge-based startup specialising in MEMS (microelectromechanical systems) semiconductor technologies, has
With the support of
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.