Welcome to the European network of Chips Competence Centres
Connecting SMEs, start-ups and innovators with semiconductor expertise, training and access to venture capital across Europe.
What do you need?
Technical expertise
Prototyping, testing, characterisation and the know-how of the competence centres.
Access expertiseAccess to capital
Connections to investors and funding opportunities across the ecosystem.
Connect with VCs
Latest News
EBSCON 2026: Crossroads Europe at a Turning Point a follow-up report
Graz/Villach, 9 October 2026. Europe is at a turning point when it comes to semiconductors, AI and strategic technologies. EBSCON, the leading trade fair for the European semiconductor and electronics industry, held in Graz on 7 October 2026, was therefore themed Crossroads Europe at a Turning Point. The central...
Equipping students and industry with practical RISC-V expertise
The 2026 edition of the SCCC course RISC-V on a chip in three days attracted a lot of applications from both students and employees at companies throughout Europe and beyond. A group of twenty participants were admitted and got to build their own physical RISC-V processors and run real hardware...
Webinar Series on Semiconductor Training Offers#1
The first aCCCess webinar of the semiconductor training offers series brought together ChipNL and CC Chip.si to introduce their training offers and highlight opportunities for professionals, organisations and other stakeholders looking to strengthen their semiconductor knowledge and skills....
Open Calls
Open Access to FAMES Pilot Line
Opens:Mar 09, 2026 00:00 CET
Closes:Dec 31, 2026 23:59 CET
The FAMES Pilot Line accepts Spontaneous User Requests year-round, offering organisations rapid access to its advanced semiconductor technologies outside the annual Open-Access Calls. This pathway enables time-critical projects to move forward without waiting for the next call.
XECS Call 6
Opens:Jun 02, 2026 00:00 CET
Closes:Jan 21, 2027 17:00 CET
Xecs is an Eureka Cluster specifically designed to accelerate the pace of sustainable industrial innovation in the Electronics Components & Systems (ECS) community. Xecs intends to create an ambitious international collaboration programme. The resulting RD&I projects will generate high societal and economic impact for all those who participate in an Xecs project.
INFRACHIP Open Call to Free Access to State-of-the-Art Technologies
INFRACHIP is a European project under Horizon Europe Programme, offering distributed research infrastructure as a wider European research platform for the sustainable development of next-generation and future semiconductor chips.
Events
Advanced Packaging Workshop
Oct 15, 2026 09:00 GMTOct 15, 2026 16:30 GMT
IDA officesDublin, Ireland
The Advanced Packaging Workshop will bring together experts from across research and industry to explore key developments in chiplet integration, advanced substrates, interconnects, assembly, testing and manufacturing. It will also examine semiconductor policy, investment and supply chains, with a focus on accelerating innovation from research through to scalable manufacturing and...
Event hosted by
Micro Nano & Chips Tech 2026
Oct 15, 2026 09:00 EETOct 18, 2026 18:00 EET
Ancient Olive Grove Conference Center, University of West AtticaThivon 250, Egaleo, 122 41, Athens, Greece
MICRO NANO & CHIPS TECH is a well-established conference series that brings together researchers, academics, industry professionals, and students working in micro- and nanoelectronics, nanotechnology, and MEMS-related fields. The event provides an excellent forum for the presentation of recent scientific and technological advances, as well as for the development of...
Event hosted by
Emerging Tech Conference Edge Intelligence 2026
Oct 22, 2026 09:00 CESTOct 23, 2026 18:00 CEST
Karolos Papoulias Conference CenterUniversity of, Ioannina, 455 00
ETCEI 2026 is a leading conference dedicated to showcasing innovation, research, and industrial collaboration in microelectronics, semiconductors, and emerging technologies. It aims to strengthen Europes Chips ecosystem by fostering dialogue between academia, industry, and policymakers. Organized by HETiA under the framework of the Hellenic Chips Competence Centre (HCCC) project, supported...
Event hosted by
Latest Trends
Thermally Conductive Insulators Market Size, Share, and Trends - Global Forecast 2026-2032 | EVs, AI Data Centers, and Power Electronics Drive Growth to USD 1.03 Billion
"Thermally Conductive Insulators Market - Global Forecast 2026-2032" has been added to ResearchAndMarkets.com's offering.
Entering the mainstream 8-inch SiC market! Guangyun's subsidiary, Shengxin Materials, will be listed on the Emerging Stock Market on October 15th.
Guangyun Group's subsidiary, Shengxin Materials, is expected to be listed on the Emerging Stock Market on October 15th. As N-type conductive SiC products have entered the mainstream 8-inch form factor, the company is currently mass-producing 6-inch and 8-inch conductive and semi-insulating SiC ingots and substrates. Products are gradually entering a stable supply phase, and with customer product verification completed, shipments are expected to continue to increase in 2026. Shengxin Materials was established in 2020, primarily focusing on...
Powering the AI revolution: Inside the grid, thermal, and interconnect challenges limiting data center growth
We take a deep dive into the electrical, thermal, and infrastructural bottlenecks affecting the next-generation computing revolution.
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.