Building a stronger European semiconductor ecosystem with the European Network of Chips Competence Centers
About aCCCess
aCCCess (Alliance of Chips Competence Centres for Enhanced Semiconductor Services) is a four-year Coordination and Support Action launched in March 2025 under the EU Chips Act. It aims to build a strong, interconnected European Network of Chips Competence Centres (ENCCC) that enables innovation, facilitates access to advanced semiconductor services, and strengthens Europe’s position in the global semiconductor value chain.
Network
Our network is comprised of Chip Competence Centers, Pilot lines and Design Platforms. Together, PLs and the DP empower the CCCs with cutting-edge infrastructure.
What is a Competence Center?
A Chips Competence Centre (CCC)is a hub of excellence providing access to specialised semiconductor knowledge, training, prototyping, testing, and small-scale production. These centres are pivotal to Europe's semiconductor strategy by:
- Supporting SMEs and start-ups with innovation services
- Bridging the gap between research and industry
- Promoting regional and pan-European know-how in chips and microelectronics
What is a Pilot Line & a Design Platform?
Pilot Lines (PLs) are advanced manufacturing facilities that help scale innovations from research to production, enabling validation in relevant environments.
The Design Platform (DP) is a cloud-based virtual environment providing state-of-the-art Electronic Design Automation (EDA) tools and design libraries to:
- Accelerate chip design and prototyping
- Enable collaboration across Europe
- Support education and skills development in semiconductor design
Latest News
Chips Think Tank Webinar-6
Exploring the Future of Investment in Deeptech & Photonics ...
Chips from the North: Connecting Design and Manufacturing in Europe
On 23-24 March, the Chips from the North event in Helsinki, organised by FiCCC, brought together Europe's semiconductor community to explore available support for companies across the value chain....
ENCCC Annual Meeting: Strengthening Europes Semiconductor Network
First Annual Meeting of CCCs was held on 5-6 February in Brussels...
Open Calls
Chips Venture Forum 2026
Opens:Mar 17, 2026 09:00 CET
Closes:May 12, 2026 18:00 CET
The 2026 edition of the Chips Venture Forum will introduce an enhanced format designed to maximize interactions with investors and increase visibility across the semiconductor ecosystem.
APECS Open Access Call
Opens:Apr 01, 2026 00:00 CET
Closes:Jun 30, 2026 23:59 CET
The APECS Pilot Line launches it's first annual Open Access Calls!
As part of the APECS pilot lines broader access strategy, the annual Open Access Calls invite players across the semiconductor value chain to submit project ideas for selected pilot line technologies. The calls provide structured, guided, and transparent access to APECS modern R&D infrastructure, enabling companies, RTOs and universities to validate concepts, accelerate development, and collaborate directly with APECS experts.
Open Access to FAMES Pilot Line
Opens:Mar 09, 2026 00:00 CET
Closes:Dec 31, 2026 23:59 CET
The FAMES Pilot Line accepts Spontaneous User Requests year-round, offering organisations rapid access to its advanced semiconductor technologies outside the annual Open-Access Calls. This pathway enables time-critical projects to move forward without waiting for the next call.
Events
Webinar | From Lab to Market: How APECS and ChipNL CC enable advanced packaging in Europe
May 12, 2026 10:00 CETMay 12, 2026 11:00 CET
Online
Advanced packaging and heterogeneous integration play an increasingly important role in the further development of the European semiconductor industry. They make it possible to bring different technologies, functions, and components closer together, thus forming an important link between research, application, and market introduction. On Tuesday, May 12, 2026, the webinar From...
Event hosted by
aCCCess Webinar on Technology Offers #1
May 12, 2026 10:00 CESTMay 12, 2026 11:00 CEST
Webinar
## The aCCCess Webinar Series on Technology Offers The webinar series will focus on technology offers of pilot lines, chips competence centres and beyond. On each webinar we will have one technology on spotlight and also focus on collaborations between ENCCC acteurs and user experiences. [Join us](https://events.teams.microsoft.com/event/1c57a35a-c5ea-41b9-a369-17adfd7cf6ef@2aebdaed-03ac-495c-b5c6-63033f7fd03d) for the first webinar...
Event hosted by
Riga Chip Summit 2026
May 13, 2026 08:30 EESTMay 13, 2026 17:00 EEST
Riga, Latvia at the VEF Kamerzale Spidola. Ieriku str. 5A, Riga, Latvia
**Riga Chip Summit 2026** is the first chip dedicated summit in Latvia organised by the Latvian Chip Competence Centre (LCCC). The summit will bring together stakeholders from industry, academia, finance, competence centres, start-ups, and SMEs from the NordicBaltic region and the wider European ecosystem. The event aims to explore opportunities,...
Event hosted by
Latest Trends
Lattice Semiconductor shares rose after the announcement of the acquisition of software company AMI.
(Automated translation by Reuters using machine learning and generative AI, please refer to the following disclaimer: May 4 - ** Lattice Semiconductor LSCC.O shares are up about 2% at $126.80
STMicroelectronics reveals VIPerGaN 100W converters for energy-efficient appliances
STMicroelectronics has introduced two 100-Watt VIPerGaN high-voltage converters, extending wide-bandgap energy savings throughout domestic appliances, building and home automation, smart lighting, …
GlobalFoundries accelerates adoption of co-packaged optics for advanced AI data centers with SCALE optical module solution
04.05.2026 - SCALE CPO solution is the industry’s first OCI MSA capable platform and built with GF’s proven silicon photonics technologyMALTA, N.Y., May 04, 2026 (GLOBE NEWSWIRE) - GlobalFoundries (Nasdaq: GFS) (GF) today announced the introduction of its ...
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.