Building a stronger European semiconductor ecosystem with the European Network of Chips Competence Centers
About aCCCess
aCCCess (Alliance of Chips Competence Centres for Enhanced Semiconductor Services) is a four-year Coordination and Support Action launched in March 2025 under the EU Chips Act. It aims to build a strong, interconnected European Network of Chips Competence Centres (ENCCC) that enables innovation, facilitates access to advanced semiconductor services, and strengthens Europe’s position in the global semiconductor value chain.
Network
Our network is comprised of Chip Competence Centers, Pilot lines and Design Platforms. Together, PLs and the DP empower the CCCs with cutting-edge infrastructure.
What is a Competence Center?
A Chips Competence Centre (CCC)is a hub of excellence providing access to specialised semiconductor knowledge, training, prototyping, testing, and small-scale production. These centres are pivotal to Europe's semiconductor strategy by:
- Supporting SMEs and start-ups with innovation services
- Bridging the gap between research and industry
- Promoting regional and pan-European know-how in chips and microelectronics
What is a Pilot Line & a Design Platform?
Pilot Lines (PLs) are advanced manufacturing facilities that help scale innovations from research to production, enabling validation in relevant environments.
The Design Platform (DP) is a cloud-based virtual environment providing state-of-the-art Electronic Design Automation (EDA) tools and design libraries to:
- Accelerate chip design and prototyping
- Enable collaboration across Europe
- Support education and skills development in semiconductor design
Latest News
The European Semiconductor industry comes together: The HCHiP Collaboration Days in Budapest were a success!
The purpose of the international conference was to enhance creating a competitive semiconductor ecosystem in Hungary. The mission of HCHiP event focuses on transforming knowledge into real industrial value. Moreover, we declared the HCHiP is not a single research project, but a long-term strategic ecosystem program. That is precisely why...
Riga Chip Summit 2026: Strengthening Europes Semiconductor Ecosystem
On 13 May 2026, the Latvian Chip Competence Centre hosted the Riga Chip Summit 2026, the first-ever semiconductor-focused summit in Latvia. The event marked a significant milestone for the Baltic and European semiconductor landscape, bringing together over 200 participants from 23 countries, including industry leaders, researchers, startups, investors, policymakers, and...
Czech Semicon Days 2026
The Czech Semiconductor Centre took part in this years Czech Semicon Days 2026 as an expert partner of the international forum organised by CzechInvest. The event, held from 18 to 20 May in Prague, Brno and Usti nad Labem, connected Czech semiconductor expertise with leading European and global partners, investors,...
Open Calls
APECS Open Access Call
Opens:Apr 01, 2026 00:00 CET
Closes:Jun 30, 2026 23:59 CET
The APECS Pilot Line launches it's first annual Open Access Calls!
As part of the APECS pilot lines broader access strategy, the annual Open Access Calls invite players across the semiconductor value chain to submit project ideas for selected pilot line technologies. The calls provide structured, guided, and transparent access to APECS modern R&D infrastructure, enabling companies, RTOs and universities to validate concepts, accelerate development, and collaborate directly with APECS experts.
Open Access to FAMES Pilot Line
Opens:Mar 09, 2026 00:00 CET
Closes:Dec 31, 2026 23:59 CET
The FAMES Pilot Line accepts Spontaneous User Requests year-round, offering organisations rapid access to its advanced semiconductor technologies outside the annual Open-Access Calls. This pathway enables time-critical projects to move forward without waiting for the next call.
XECS Call 6
Opens:Jun 02, 2026 00:00 CET
Closes:Jan 21, 2027 17:00 CET
Xecs is an Eureka Cluster specifically designed to accelerate the pace of sustainable industrial innovation in the Electronics Components & Systems (ECS) community. Xecs intends to create an ambitious international collaboration programme. The resulting RD&I projects will generate high societal and economic impact for all those who participate in an Xecs project.
Events
EPoSS Annual Forum 2026
Jun 16, 2026 12:00 GMTJun 19, 2026 13:00 GMT
INL International Iberian Nanotechnology LaboratoryAv. Mte. Jose Veiga s/n, 4715-330 Braga, Portugal
The EPoSS Annual Forum 2026 will take place from June 16-19 in Braga, Portugal, kindly co-hosted by the EPoSS member INL - International Iberian Nanotechnology Laboratory. The Annual Forum offers sessions with high-ranking representatives from the EU, local authorities, institutions and companies, thematic sessions, poster presentations, start-up award pitch and...
Event hosted by
Sustainability of Chips: Impact of Emerging Chip Technologies, Clean-Tech Applications and Policy-Enabled Innovation
Jun 17, 2026 15:00 CETJun 17, 2026 18:00 CET
Tampere Hall, Tampere, Finland. Side event to ISLC 2026.Yliopistonkatu 55 PL 16, 33101 TAMPERE
Semiconductor photonics sits at the intersection of two urgent sustainability challenges: reducing the environmental footprint of advanced microelectronics and enabling the clean-tech applications that help monitor and protect our environment. This half-day workshop, co-organised by the Finnish ( https://www.ficcc.eu/ ) and Austrian Chips Competence Centres (https://atc3.at/) as part of...
Event hosted by
3D & Systems Summit
Jun 17, 2026 18:00 CETJun 19, 2026 12:00 CET
Hilton Dresden Hotel An der Frauenkirche 5 01067 Dresden Germany
Enabling next-gen heterogeneous systems integration This year, the 3D & Systems Summit is dedicated to Enabling Next-Gen Heterogeneous Systems Integration, focused on exploring strategies for enhancing Europe's semiconductor industry, addressing topics as geopolitical dynamics, market trends, as well as the latest advancements in chiplet applications and hybrid bonding techniques. The...
Event hosted by
Latest Trends
South Wales Semiconductor Cluster Delivers £436m Impact, New Report Shows - Semiconductor Digest
CSconnected has published its Strength in Places Fund (SIPF) impact report 2026, marking the conclusion of a transformative programme that has established South Wales as a globally recognised hub for compound semiconductor innovation.
Infineon to Open German Chip Fab as Part of EU Sovereignty Push
Infineon is set to open a $5.8 billion power-chip fab in Dresden on July 2, backed by about $1.1 billion in EU Chips Act subsidies. The plant will make power semiconductors for AI data centers and could eventually add up to $5.8 billion in annual revenue as demand for AI infrastructure strains global electricity systems....
#74: SpaceX IPO and Elon Musk's Terafab, safety-critical semiconductors "Made in Europe", Freiberg Silicon Days - Silicon Saxony
Also in this episode: Fraunhofer annual conference with the presentation of research prizes, water shortage jeopardizes EU Chips Act project in Sicily
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.