Building a stronger European semiconductor ecosystem with the European Network of Chips Competence Centers
About aCCCess
aCCCess (Alliance of Chips Competence Centres for Enhanced Semiconductor Services) is a four-year Coordination and Support Action launched in March 2025 under the EU Chips Act. It aims to build a strong, interconnected European Network of Chips Competence Centres (ENCCC) that enables innovation, facilitates access to advanced semiconductor services, and strengthens Europe’s position in the global semiconductor value chain.
Network
Our network is comprised of Chip Competence Centers, Pilot lines and Design Platforms. Together, PLs and the DP empower the CCCs with cutting-edge infrastructure.
What is a Competence Center?
A Chips Competence Centre (CCC) is a hub of excellence providing access to specialised semiconductor knowledge, training, prototyping, testing, and small-scale production. These centres are pivotal to Europe's semiconductor strategy by:
- Supporting SMEs and start-ups with innovation services
- Bridging the gap between research and industry
- Promoting regional and pan-European know-how in chips and microelectronics
What is a Pilot Line & a Design Platform?
Pilot Lines (PLs) are advanced manufacturing facilities that help scale innovations from research to production, enabling validation in relevant environments.
The Design Platform (DP) is a cloud-based virtual environment providing state-of-the-art Electronic Design Automation (EDA) tools and design libraries to:
- Accelerate chip design and prototyping
- Enable collaboration across Europe
- Support education and skills development in semiconductor design
Latest News
Chips Venture Forum
Are you building the future of semiconductors, AI-powered systems, advanced materials, or edge computing? Benefit from the strengths of Competence Centres across Europe by joining a vibrant ecosystem of innovators and key stakeholders. This is your chance to accelerate your ideas and connect with experts in the semiconductor value chain....
Greek chips at the heart of innovation
Launched on 1 June 2025, the Hellenic Chips Competence Centre (HCCC) is Greece’s first semiconductor hub, established through a partnership between HETiA, the Ministry of Development, and the European Chips Joint Undertaking. With €7 million in funding, HCCC aims to strengthen Europe’s technological autonomy by supporting innovation, research, start-ups, and...
Enhancing chip performance
The European semiconductor sector is experiencing significant growth, fueled by increasing investments in research and development. Companies are focusing on enhancing chip performance and energy efficiency to meet the needs of various industries....
Open Calls
Join the 2D-PL Multi-Project Wafer Runs! | SCCC
Opens:Aug 01, 2025 07:00 CET
Closes:Nov 30, 2025 16:00 CET
The 2D Pilot Line (2D-PL) part of the Graphene Flagship and a key pilot line within the Swedish Chips Competence Centre (SCCC) is now accepting applications for upcoming multi-project wafer (MPW) runs!
Please note: Each MPW run has its own deadline, so make sure to stay updated and submit your application in time!
Open Access to FAMES Pilot Line
Opens:Dec 31, 2024 23:00 CET
Closes:Dec 31, 2025 22:59 CET
The FAMES Pilot Line accepts Spontaneous User Requests year-round, offering organisations rapid access to its advanced semiconductor technologies outside the annual Open-Access Calls. This pathway enables time-critical projects to move forward without waiting for the next call.
Xecs Call 5
Closes:Jan 22, 2026 17:00 CET
Xecs Call 5 is open! Submit your Project Outline by 22 January 2026 (17:00 CET)!
Events
Webinar Technical deep dive APECS pilot line by Fraunhofer/FMD
Nov 11, 2025 10:00 CESTNov 11, 2025 11:00 CEST
Online
Are you ready to dive into the cutting edge of advanced packaging and heterogeneous integration? Join us for a webinar on 11 November from 10:00-11:00 CEST that showcases the core technologies powering the APECS pilot line, your gateway to seamless process chains from design to packaging, including characterization, testing, and...
Event hosted by
FAMES technical workshop
Nov 17, 2025 08:45 CETNov 17, 2025 17:00 CET
LIT Open Innovation Center JKU Linz Austria
The FAMES Pilot Line organises a technical workshop with the topic EU CHIPS & INNOVATION in Linz, Austria on 17 November 2025. The workshop is organised one day before the SEMICON EUROPE held in Messe Munich and provides bus transfer to Munich after the workshop! The FAMES Pilot Line provides chipmakers,...
Event hosted by
SEMICON EUROPE
Nov 18, 2025 09:00 CETNov 21, 2025 17:00 CET
Messe MunchenMesse Munchen
In 2025, the European semiconductor industry will once again meet at the largest semiconductor trade fair [SEMICON Europa](https://www.semiconeuropa.org/) in Munich from November 18-21. At the same time, [productronica](https://productronica.com/en/), the world's leading trade fair for the entire range of technologies and solutions for electronics production, will take place in the exhibition...
Event hosted by
Latest Trends
China allows export of Nexperia chips for civilian use
China has granted exemptions from export controls for chip manufacturer Nexperia, whose shipments were previously suspended due to tensions between Beijing and the Netherlands.
Laser-assisted preparation of flexible wearable electronics with copper-liquid metal patterns
Publication date: 1 December 2025Source: Chemical Engineering Journal, Volume 525Author(s): Sheng Sun, Hong Ma, Shuren Shao, Xiyu Wang, Aimin Zhang, Jihai Zhang
RAAAM Memory: $17.5 Million Series A Raised To Advance On-Chip Memory Production
RAAAM Memory Technologies announced that it has raised $17.5 million in an oversubscribed Series A funding round to support the mass production and full qualification of its patented on-chip memory technology, GCRAM. The round was led by NXP Semiconductors and included participation from a leading multinational networking corporation, IAG Capital Partners, EIC Fund, LiFTT, Alumni Ventures, and existing investors J-Ventures, Silicon Catalyst Ventures, and Serpentine Ventures. The new funding brings the company’s total capital raised to over $24 million, combining equity financing with the EIC Accelerator grant.
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.