
aCCCess (Alliance of Chips Competence Centres for Enhanced Semiconductor Services) is a four-year Coordination and Support Action launched in March 2025 under the EU Chips Act. It aims to build a strong, interconnected European Network of Chips Competence Centres (ENCCC) that enables innovation, facilitates access to advanced semiconductor services, and strengthens Europe’s position in the global semiconductor value chain.





Our network is comprised of Chip Competence Centers, Pilot lines and Design Platforms. Together, PLs and the DP empower the CCCs with cutting-edge infrastructure.
A Chips Competence Centre (CCC)is a hub of excellence providing access to specialised semiconductor knowledge, training, prototyping, testing, and small-scale production. These centres are pivotal to Europe's semiconductor strategy by:
Pilot Lines (PLs) are advanced manufacturing facilities that help scale innovations from research to production, enabling validation in relevant environments.
The Design Platform (DP) is a cloud-based virtual environment providing state-of-the-art Electronic Design Automation (EDA) tools and design libraries to:

Exploring the Future of Investment in Deeptech & Photonics ...

On 23-24 March, the Chips from the North event in Helsinki, organised by FiCCC, brought together Europe's semiconductor community to explore available support for companies across the value chain....

First Annual Meeting of CCCs was held on 5-6 February in Brussels...

Closes:May 07, 2026 17:00 CET
The Chips JU has two open calls for proposals under its Electronic Components & Systems (ECS) programme, funded through Horizon Europe. Deadline for project outline is 7 May 2026!

Opens:Apr 08, 2026 00:00 CEST
Closes:May 07, 2026 17:00 CEST
The EuroCDP launched its Venture Building Programmes, a dedicated acceleration and incubation track designed to help European fabless startups move faster, design smarter, and validate their first silicon with confidence.

Opens:Mar 17, 2026 09:00 CET
Closes:May 12, 2026 18:00 CET
The 2026 edition of the Chips Venture Forum will introduce an enhanced format designed to maximize interactions with investors and increase visibility across the semiconductor ecosystem.

May 12, 2026 10:00 CESTMay 12, 2026 11:00 CEST
Webinar
***The aCCCess Webinar Series on Technology Offers*** The webinar series will focus on technology offers of pilot lines, chips competence centres and beyond. On each webinar we will have one technology on spotlight and also focus on collaborations between ENCCC acteurs and user experiences. Join us for the first webinar of...
Event hosted by

May 12, 2026 10:00 CETMay 12, 2026 11:00 CET
Online
Advanced packaging and heterogeneous integration play an increasingly important role in the further development of the European semiconductor industry. They make it possible to bring different technologies, functions, and components closer together, thus forming an important link between research, application, and market introduction. On Tuesday, May 12, 2026, the webinar From...
Event hosted by

May 13, 2026 08:30 EESTMay 13, 2026 17:00 EEST
Riga, Latvia at the VEF Kamerzale Spidola. Ieriku str. 5A, Riga, Latvia
**Riga Chip Summit 2026** is the first chip dedicated summit in Latvia organised by the Latvian Chip Competence Centre (LCCC). The summit will bring together stakeholders from industry, academia, finance, competence centres, start-ups, and SMEs from the NordicBaltic region and the wider European ecosystem. The event aims to explore opportunities,...
Event hosted by

(Automated translation by Reuters using machine learning and generative AI, please refer to the following disclaimer: May 4 - ** Lattice Semiconductor LSCC.O shares are up about 2% at $126.80

STMicroelectronics has introduced two 100-Watt VIPerGaN high-voltage converters, extending wide-bandgap energy savings throughout domestic appliances, building and home automation, smart lighting, …

04.05.2026 - SCALE CPO solution is the industry’s first OCI MSA capable platform and built with GF’s proven silicon photonics technologyMALTA, N.Y., May 04, 2026 (GLOBE NEWSWIRE) - GlobalFoundries (Nasdaq: GFS) (GF) today announced the introduction of its ...

aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.