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Latest News
Chips Think Tank#9: From the Chips Act to Chips Act 2.0
On November 24th, the aCCCess Chips Think Tank webinar series welcomes Marco Ceccarelli from DG CONNECT to discuss the European Commissions assessment of the Chips Act and the changes proposed under the Chips Act 2.0....
aCCCess Webinar on Technology Offers #4
The latest edition of the aCCCess Webinar Series on Technology Offers brought together experts from PIXSpain and PIXEurope to explore how European initiatives are accelerating the development and industrialisation of Photonic Integrated Circuits (PICs)....
Chips Think Tank #8 - Rethinking Advanced Packaging for Strategic Markets
The latest edition of the aCCCess Chips Think Tank webinar series brought together semiconductor stakeholders to discuss how advanced packaging can support strategic markets where production volumes are limited but reliability requirements are exceptionally high....
Open Calls
Open Access to FAMES Pilot Line
Opens:Mar 09, 2026 00:00 CET
Closes:Dec 31, 2026 23:59 CET
The FAMES Pilot Line accepts Spontaneous User Requests year-round, offering organisations rapid access to its advanced semiconductor technologies outside the annual Open-Access Calls. This pathway enables time-critical projects to move forward without waiting for the next call.
XECS Call 6
Opens:Jun 02, 2026 00:00 CET
Closes:Jan 21, 2027 17:00 CET
Xecs is an Eureka Cluster specifically designed to accelerate the pace of sustainable industrial innovation in the Electronics Components & Systems (ECS) community. Xecs intends to create an ambitious international collaboration programme. The resulting RD&I projects will generate high societal and economic impact for all those who participate in an Xecs project.
INFRACHIP Open Call to Free Access to State-of-the-Art Technologies
INFRACHIP is a European project under Horizon Europe Programme, offering distributed research infrastructure as a wider European research platform for the sustainable development of next-generation and future semiconductor chips.
Events
Chips Venture Forum 2026 Final Event
Nov 10, 2026 09:00 CETNov 13, 2026 18:00 CET
Munich (Germany)SEMICON
The 2026 edition of the Chips Venture Forum will introduce an enhanced format designed to maximize interactions with investors and increase visibility across the semiconductor ecosystem. The Chips Venture Forum will now unfold in two complementary stages: 1.Chips Venture Forum Selection at INPHO Venture Summit, in Bordeaux **(21-22 October 2026)** ...
Event hosted by
SEMICON Europa: ITF Chip into the Future
Nov 10, 2026 10:00 CETNov 10, 2026 12:00 CET
Messe MunchenMesse Munchen
Europe's next era: Navigating the perfect storm SEMICON Europa 2026 is co-located with electronica in Munich, Germany creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain. This year's theme centers on the increasingly interconnected relationship between technological innovation and...
Event hosted by
Chips Think Tank#9: From the Chips Act to Chips Act 2.0
Nov 24, 2026 12:00 CETNov 24, 2026 13:00 CET
Webinarhttps://attendee.gotowebinar.com/register/8917859995999445593
As part of the **Chips Think Tank** webinar series, we are pleased to invite you to a discussion on the next phase of Europes semiconductor strategy. The European Chips Act marked a major step in strengthening Europes semiconductor ecosystem. The industry keeps evolving rapidly, and Europe now has the opportunity to...
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Latest Trends
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Alice & Bob Claims New Benchmark for Breaking RSA-2048 in Days
French quantum computing startup Alice & Bob estimates that 23,000 cat qubits could break RSA-2048 encryption in three days, while 30,000 could defeat blockchain
Nvidia unveils next-generation CPO technology prototype
NVIDIA recently showcased its next-generation co-packaged optics technology, named OOI, at SEMICON West 2026. OOI removes the organic packaging substrate, directly integrating the optical engine onto the silicon interposer that houses the GPU...
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.