
aCCCess (Alliance of Chips Competence Centres for Enhanced Semiconductor Services) is a four-year Coordination and Support Action launched in March 2025 under the EU Chips Act. It aims to build a strong, interconnected European Network of Chips Competence Centres (ENCCC) that enables innovation, facilitates access to advanced semiconductor services, and strengthens Europe’s position in the global semiconductor value chain.





Our network is comprised of Chip Competence Centers, Pilot lines and Design Platforms. Together, PLs and the DP empower the CCCs with cutting-edge infrastructure.
A Chips Competence Centre (CCC)is a hub of excellence providing access to specialised semiconductor knowledge, training, prototyping, testing, and small-scale production. These centres are pivotal to Europe's semiconductor strategy by:
Pilot Lines (PLs) are advanced manufacturing facilities that help scale innovations from research to production, enabling validation in relevant environments.
The Design Platform (DP) is a cloud-based virtual environment providing state-of-the-art Electronic Design Automation (EDA) tools and design libraries to:

Exploring the Future of Investment in Deeptech & Photonics ...

On 23-24 March, the Chips from the North event in Helsinki, organised by FiCCC, brought together Europe's semiconductor community to explore available support for companies across the value chain....

First Annual Meeting of CCCs was held on 5-6 February in Brussels...

Opens:Apr 01, 2026 00:00 CET
Closes:Jun 30, 2026 23:59 CET
The APECS Pilot Line launches it's first annual Open Access Calls!
As part of the APECS pilot lines broader access strategy, the annual Open Access Calls invite players across the semiconductor value chain to submit project ideas for selected pilot line technologies. The calls provide structured, guided, and transparent access to APECS modern R&D infrastructure, enabling companies, RTOs and universities to validate concepts, accelerate development, and collaborate directly with APECS experts.

Opens:Mar 09, 2026 00:00 CET
Closes:Dec 31, 2026 23:59 CET
The FAMES Pilot Line accepts Spontaneous User Requests year-round, offering organisations rapid access to its advanced semiconductor technologies outside the annual Open-Access Calls. This pathway enables time-critical projects to move forward without waiting for the next call.
INFRACHIP is a European project under Horizon Europe Programme, offering distributed research infrastructure as a wider European research platform for the sustainable development of next-generation and future semiconductor chips.

May 13, 2026 08:30 EESTMay 13, 2026 17:00 EEST
Riga, Latvia at the VEF Kamerzale Spidola. Ieriku str. 5A, Riga, Latvia
**Riga Chip Summit 2026** is the first chip dedicated summit in Latvia organised by the Latvian Chip Competence Centre (LCCC). The summit will bring together stakeholders from industry, academia, finance, competence centres, start-ups, and SMEs from the NordicBaltic region and the wider European ecosystem. The event aims to explore opportunities,...
Event hosted by

May 18, 2026 10:00 CETMay 22, 2026 16:00 CET
PragueWilsonova 300/8, Vinohrady, 110 00 Praha-Praha 2, Czechia
Join us at Czech Semicon Days 2026, one of the key events for the semiconductor sector in Central Europe. From 18th May 2026 in Prague, industry leaders, researchers, investors and policymakers will come together to discuss the future of semiconductors and their role in next-generation mobility, autonomous systems and electrification. The programme...
Event hosted by

May 19, 2026 08:30 CETMay 20, 2026 18:30 CET
Antwerp, BelgiumKoningin Astridplein 20-26, 2018 - Antwerp, Belgium
Discover the future of AI at ITF world The race toward the next frontier in artificial intelligence is making daily headlines. But reaching next-gen AI isn't a sprint; it's a marathon. The rewards will be shared by humanity: applications that far exceed anyone's imagination, in domains such as healthcare, mobility, and...
Event hosted by

(Image: Fraunhofer IZM / Volker Mai) Fraunhofer IZM has developed an inverter for electric drives that processes 500 kilowatts of power in a volume of one liter – many times more than conventional alternatives. The inverter, developed for Mitsubishi Heavy Industries (MHI), achieves an efficiency of 99 percent.

This work presents a monolithic CMOS-MEMS multi-parameter gas detection system-on-chip (SoC), integrating a metal-oxide gas sensor, a piezoresistive flow sensor, and signal conditioning circuit. The stacked integration architecture enables compact system design. The optimized fabrication process parameters, including the sputtering atmosphere for SnO2 sensing layer and implantation method for piezoresistors, further enhance sensitivity. The microbridge structure of the gas sensor, combined with the working principle of the piezoresistive flow sensor, enables low-power operation. Furthermore, an on-chip signal conditioning circuit is monolithically integrated to enhance signal quality. Experimental results show that the proposed SoC exhibits gas sensitivity (Ra/Rg) of 4.2 at 60 ppm H2 and flow sensitivity of 49 mV/(L/min) at 1.6 L/min with power consumption below 20 mW. These results highlight the potential of the proposed SoC as a high-sensitivity and low-power gas detection solution for hydrogen energy applications.

Xanadu Quantum Technologies and semiconductor equipment supplier EV Group (EVG) have announced a strategic partnership.

aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.