
Connecting SMEs, start-ups and innovators with semiconductor expertise, training and access to venture capital across Europe.
Prototyping, testing, characterisation and the know-how of the competence centres.
Access expertiseConnections to investors and funding opportunities across the ecosystem.
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How RIBER is expanding beyond III-V epitaxy to enable the next generation of photonic devices....

The Industrial Alliance for Semiconductors brings together Europes key microelectronics stakeholders through dedicated working groups addressing strategic challenges. One of these groups focuses on PFAS in semiconductor manufacturing, tackling the balance between environmental concerns and industrial needs. A new white paper outlines research priorities to support this transition....

The European Chips Act 2.0, presented on 3 June 2026, shifts the focus to demand for European chips. ChipNL CC reflects on what this means for the Dutch semiconductor ecosystem....

Opens:Jul 07, 2026 09:00 CET
Closes:Sep 30, 2026 17:00 CET
New Chips JU calls now open for applications, worth over 300 million in EU funding.
The calls span the two pillars of the programme: Electronic Components and Systems (ECS), which funds research and innovation projects, and the Chips for Europe Initiative, which funds capacity building and infrastructure.

Opens:Mar 09, 2026 00:00 CET
Closes:Dec 31, 2026 23:59 CET
The FAMES Pilot Line accepts Spontaneous User Requests year-round, offering organisations rapid access to its advanced semiconductor technologies outside the annual Open-Access Calls. This pathway enables time-critical projects to move forward without waiting for the next call.

Opens:Jun 02, 2026 00:00 CET
Closes:Jan 21, 2027 17:00 CET
Xecs is an Eureka Cluster specifically designed to accelerate the pace of sustainable industrial innovation in the Electronics Components & Systems (ECS) community. Xecs intends to create an ambitious international collaboration programme. The resulting RD&I projects will generate high societal and economic impact for all those who participate in an Xecs project.

Sep 21, 2026 13:30 CESTSep 22, 2026 16:30 CEST
INSTN CEA Grenoble 17 avenue des Martyrs, 38000 Grenoble, FRANCE
This short course on FD-SOI technology is intended for experienced chip designers, technologists and newcomers to the field. Led by industry experts, it will provide a comprehensive overview of FD-SOI technology and its benefits, addressing multiple aspects of circuit design. Participants will learn how to efficiently design digital, analog and RF...
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Sep 22, 2026 10:00 CESTSep 22, 2026 11:00 CEST
Webinar
The semiconductor sector is evolving rapidly, creating an increasing need for skilled professionals and continuous upskilling. To help the community discover the training opportunities available across Europe, aCCCess Focus Group 4 is launching a new Webinar Series on Semiconductor Training Offers. Starting on 22 September 2026, the series will take place...
Event hosted by

Sep 22, 2026 16:00 CETSep 22, 2026 16:45 CET
Workshop Room 2 bcc Berlin, Alexanderstrasse 11, 10178 Berlin.
**Workshop Description:** Artificial Intelligence is increasingly moving beyond the data center and into the physical world. From autonomous robots, drones and vehicles to intelligent infrastructure, these systems must be able to make safe and efficient decisions in real time. To achieve this, AI needs to be executed directly on the device...
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NXP Semiconductors (NasdaqGS:NXPI) has drawn fresh attention after recent share price moves, with the stock last closing at US$236.62. Investors are weighing

Global GSA Group appoints airline industry veteran Kevin Wang as Managing Director in Taiwan to drive commercial growth and expand partnerships.

Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — has issued two new technical white papers addressing critical power conversion challenges in two rapidly evolving markets: AI data centers and high-performance multi-axis motor drives...

aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.