Building a stronger European semiconductor ecosystem with the European Network of Chips Competence Centers
About aCCCess
aCCCess (Alliance of Chips Competence Centres for Enhanced Semiconductor Services) is a four-year Coordination and Support Action launched in March 2025 under the EU Chips Act. It aims to build a strong, interconnected European Network of Chips Competence Centres (ENCCC) that enables innovation, facilitates access to advanced semiconductor services, and strengthens Europe’s position in the global semiconductor value chain.
Network
Our network is comprised of Chip Competence Centers, Pilot lines and Design Platforms. Together, PLs and the DP empower the CCCs with cutting-edge infrastructure.
What is a Competence Center?
A Chips Competence Centre (CCC)is a hub of excellence providing access to specialised semiconductor knowledge, training, prototyping, testing, and small-scale production. These centres are pivotal to Europe's semiconductor strategy by:
- Supporting SMEs and start-ups with innovation services
- Bridging the gap between research and industry
- Promoting regional and pan-European know-how in chips and microelectronics
What is a Pilot Line & a Design Platform?
Pilot Lines (PLs) are advanced manufacturing facilities that help scale innovations from research to production, enabling validation in relevant environments.
The Design Platform (DP) is a cloud-based virtual environment providing state-of-the-art Electronic Design Automation (EDA) tools and design libraries to:
- Accelerate chip design and prototyping
- Enable collaboration across Europe
- Support education and skills development in semiconductor design
Latest News
aCCCess Webinar Series Technology Offers #1
The first webinar of the aCCCess Webinar Series on Technology Offers featured the APECS Pilot Line, showcasing its advanced packaging and heterogeneous integration capabilities under the EU Chips Act. The session highlighted collaboration with the ChipNL Competence Centre and explored how joint efforts support innovation, industry uptake, and the strengthening...
Chips Think Tank Webinar-6
Exploring the Future of Investment in Deeptech & Photonics ...
Chips from the North: Connecting Design and Manufacturing in Europe
On 23-24 March, the Chips from the North event in Helsinki, organised by FiCCC, brought together Europe's semiconductor community to explore available support for companies across the value chain....
Open Calls
APECS Open Access Call
Opens:Apr 01, 2026 00:00 CET
Closes:Jun 30, 2026 23:59 CET
The APECS Pilot Line launches it's first annual Open Access Calls!
As part of the APECS pilot lines broader access strategy, the annual Open Access Calls invite players across the semiconductor value chain to submit project ideas for selected pilot line technologies. The calls provide structured, guided, and transparent access to APECS modern R&D infrastructure, enabling companies, RTOs and universities to validate concepts, accelerate development, and collaborate directly with APECS experts.
Open Access to FAMES Pilot Line
Opens:Mar 09, 2026 00:00 CET
Closes:Dec 31, 2026 23:59 CET
The FAMES Pilot Line accepts Spontaneous User Requests year-round, offering organisations rapid access to its advanced semiconductor technologies outside the annual Open-Access Calls. This pathway enables time-critical projects to move forward without waiting for the next call.
INFRACHIP Open Call to Free Access to State-of-the-Art Technologies
INFRACHIP is a European project under Horizon Europe Programme, offering distributed research infrastructure as a wider European research platform for the sustainable development of next-generation and future semiconductor chips.
Events
Advanced PDK workshop
May 27, 2026 09:00 CETMay 27, 2026 18:00 CET
imec LeuvenImec 1, Kapeldreef 75, Leuven, Belgium
Training information Join us for a fullday workshop exploring NanoICs newest finepitch redistribution layer (RDL) and dietowafer (D2W) hybridbonding process design kits (PDKs), the first openaccess interconnect PDKs enabling highdensity, energyefficient chiptochip integration. During this handson training, youll discover how these advanced packaging technologies unlock new capabilities for advanced system integration. ...
Event hosted by
European Semiconductor Collaborations Days
Jun 04, 2026 09:00 CETJun 05, 2026 15:00 CET
Novotel Budapest DanubeBudapest, Bem rakpart 33-34, 1027
Chips Without Borders will bring together key stakeholders from across the European semiconductor ecosystem, including industry leaders, SMEs, research organizations, and policy representatives. The program is designed to foster collaboration, showcase innovation, and strengthen international partnerships. Hungarian SMEs, industrial stakeholders, and the HCHiP consortium itself will present their profiles, ideas, and international collaboration...
Event hosted by
3rd APECS Roadshow: Norway
Jun 04, 2026 14:00 CETJun 04, 2026 15:00 CET
Oslo Science CityGaustadalleen 21, 0349 Oslo, Norway
**The Sensor Decade 2026** brings together leading voices from academia, industry and policy to explore the future of sensing technologies and their role in addressing global challenges across climate, health, industry and digital transformation. As part of the program, APECS will contribute with a dedicated session: **APECS Session** 4 June 2026 | 14:00 The...
Event hosted by
Latest Trends
Infineon spearheads the EU's Moore4Power initiative, bringing together 62 parties from 15 countries to develop next-generation power chips.
Moore4Power is based on heterogeneous integration, and materials such as silicon, silicon carbide, and gallium nitride will be used in the most suitable fields, so as to maximize the advantages and avoid the disadvantages through "power chips".
Analog Devices: $1.5 Billion Acquisition Of Empower Semiconductor Expands AI Power Portfolio
Analog Devices announced it has entered into a definitive agreement to acquire Empower Semiconductor in an all-cash transaction valued at $1.5 billion. The deal is designed to strengthen Analog Devices’ position in high-density, energy-efficient power delivery systems for AI infrastructure and other compute-intensive applications.
EU greenlights €288m support to strengthen semiconductor supply chain
EU approves €288m German funding to strengthen the semiconductor supply chain through new Zeiss and Zadient manufacturing facilities.
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.