Building a stronger European semiconductor ecosystem with the European Network of Chips Competence Centers
About aCCCess
aCCCess (Alliance of Chips Competence Centres for Enhanced Semiconductor Services) is a four-year Coordination and Support Action launched in March 2025 under the EU Chips Act. It aims to build a strong, interconnected European Network of Chips Competence Centres (ENCCC) that enables innovation, facilitates access to advanced semiconductor services, and strengthens Europe’s position in the global semiconductor value chain.
Network
Our network is comprised of Chip Competence Centers, Pilot lines and Design Platforms. Together, PLs and the DP empower the CCCs with cutting-edge infrastructure.
What is a Competence Center?
A Chips Competence Centre (CCC)is a hub of excellence providing access to specialised semiconductor knowledge, training, prototyping, testing, and small-scale production. These centres are pivotal to Europe's semiconductor strategy by:
- Supporting SMEs and start-ups with innovation services
- Bridging the gap between research and industry
- Promoting regional and pan-European know-how in chips and microelectronics
What is a Pilot Line & a Design Platform?
Pilot Lines (PLs) are advanced manufacturing facilities that help scale innovations from research to production, enabling validation in relevant environments.
The Design Platform (DP) is a cloud-based virtual environment providing state-of-the-art Electronic Design Automation (EDA) tools and design libraries to:
- Accelerate chip design and prototyping
- Enable collaboration across Europe
- Support education and skills development in semiconductor design
Latest News
Chips from the North: Connecting Design and Manufacturing in Europe
On 23-24 March, the Chips from the North event in Helsinki, organised by FiCCC, brought together Europe's semiconductor community to explore available support for companies across the value chain....
ENCCC Annual Meeting: Strengthening Europes Semiconductor Network
First Annual Meeting of CCCs was held on 5-6 February in Brussels...
PIXSpain Competence Centre Webpage Content Available
We are pleased to announce that the PIXSpain Competence Centre webpage is now fully available, providing a comprehensive overview of our role, activities, and ecosystem engagement within the photonics ecosystem....
Open Calls
EuroCDP Venture Development Programme
Opens:Apr 08, 2026 00:00 CEST
Closes:May 01, 2026 17:00 CEST
The EuroCDP launched its Venture Building Programmes, a dedicated acceleration and incubation track designed to help European fabless startups move faster, design smarter, and validate their first silicon with confidence.
CHIPS JU ECS Calls
Closes:May 07, 2026 17:00 CET
The Chips JU has two open calls for proposals under its Electronic Components & Systems (ECS) programme, funded through Horizon Europe. Deadline for project outline is 7 May 2026!
Chips Venture Forum 2026
Opens:Mar 17, 2026 09:00 CET
Closes:May 12, 2026 18:00 CET
The 2026 edition of the Chips Venture Forum will introduce an enhanced format designed to maximize interactions with investors and increase visibility across the semiconductor ecosystem.
Events
Joint FAMES and ChipsWIN Workshop in Louvain-la-Neuve
Apr 22, 2026 09:00 CETApr 22, 2026 19:00 CET
Foyer du Lac (Aula Magna), Louvain-la-Neuve, BelgiumPlace Raymond Lemaire, 1 1348 Louvain-la-Neuve, Belgium
The FAMES-ChipsWIN Joint Event will be hosted in Louvain-la-Neuve, Belgium on April 22, 2026, from 8:30 AM to 7 PM, at Foyer du Lac (Aula Magna) and Maxwell building facilities Meet the FAMES Pilot Line and ChipsWIN communities during this one-day workshop, featuring inspiring talks, focused panel discussions, educational...
Event hosted by
13th International Conference Electrical, Electronic and Information Sciences eStream 2026
Apr 23, 2026 09:00 EESTApr 24, 2026 17:00 EEST
Vilnius Gediminas Technical University (VILNIUS TECH)Plytines str. 25, Vilnius, Lithuania
We are pleased to invite you to submit a paper and participate in the **13th International Conference Electrical, Electronic and Information Sciences eStream 2026**, organized by the **Lithuanian Chips Competence Centre (ChipsC2-LT)**. ### Scope of the Conference The conference is dedicated to fostering multidisciplinary research and the exchange of ideas across...
Event hosted by
CVF 2026 Startup Information Webinar
Apr 23, 2026 13:00 CETApr 23, 2026 14:00 CET
GoToWebinar
This webinar is dedicated to startups interested in the Chips Venture Forum 2026, providing all the key information needed to understand and apply to the program. The session will cover how the CVF works, the selection process, and what selected startups can expect in terms of investor meetings and visibility. It...
Event hosted by
Latest Trends
Taiwanese semiconductor company establishes presence in Czech Republic to enhance cybersecurity and build a non-red-light supply chain | Industry & Economy | Central News Agency (CNA)
Jmem Technology s.r.o., a Taiwanese semiconductor security solutions company, today announced the opening of its Czech office and the signing of a strategic cooperation memorandum with the Czech National Semiconductor Cluster (CNSC), laying the foundation for cooperation between the two parties in semiconductor security testing and international security standardization.
Eindhoven-based Euclyd targets €100 million funding round for AI chip expansion
Euclyd, a Dutch semiconductor company based in Eindhoven, is seeking to raise €100 million in fresh investment to expand production of chips designed for artificial intelligence (AI). Founder Bernardo Kastrup told CNBC that the funding would support the company’s efforts to scale up manufacturing capacity.
Wooptix Breaks Ground on New Semiconductor Cleanroom Facility in Spain - Semiconductor Digest
Strategic investment marks significant milestone for the company’s growth and reinforces importance of the expanding semiconductor industry in Spain.
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.