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Welcome to the European network of Chips Competence Centres

Connecting SMEs, start-ups and innovators with semiconductor expertise, training and access to venture capital across Europe.

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Technical expertise

Prototyping, testing, characterisation and the know-how of the competence centres.

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Training

Modules and programmes to build skills in chip design and technologies.

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Access to capital

Connections to investors and funding opportunities across the ecosystem.

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Events

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Baltic Photonics 2026

Sep 24, 2026 09:00 EESTSep 25, 2026 14:00 EEST

Vilnius, LithuaniaVisoriu informaciniu technologiju parkas

Baltic Photonics 2026 is an international event bringing together companies, researchers, startups, investors and technology leaders to explore the latest developments in photonics, semiconductors, space and defence technologies. Taking place on 24-25 September 2026 in Vilnius, the event will feature expert talks, B2B matchmaking, networking and company visits, creating opportunities to...

Event hosted byVITP

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IWJT

Sep 28, 2026 10:00 CETSep 28, 2026 12:00 CET

Graduate School of Sustainable Engineering for Energy, Water, and the EnvironmentGrenoble, France

Global forum for semiconductor junction formation technology The 23rd International Workshop on Junction Technology (IWJT 2026) will be held September 2829, 2026, in Grenoble, France the first time the workshop leaves Japan and China since its founding in 2000. IWJT is the premier global forum for semiconductor junction formation technology, drawing...

Event hosted byCEA-LETI

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61st International Conference on Microelectronics, Devices and Materials

Sep 28, 2026 10:00 CESTSep 30, 2026 17:00 CEST

Faculty of Electrical Engineering, LjubljanaSlovenia

The 61st International Conference on MIcroelectronics, DEvices and Materials MIDEM 2026 continues the long-standing tradition of annual international conferences organized by the MIDEM Society. For decades, the conference has brought together leading Slovenian and international experts in the fields of microelectronics and materials research and innovation.Covering a broad field...

Event hosted byCC Chip.Si

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aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.

Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.