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Latest News
Webinar Recording Now Available: Your Gateway to European Semiconductor Technologies
The recording of the joint webinar Your Gateway to European Semiconductor Technologies: CCCs, Pilot Lines & EuroCDP, held on 12 October 2026, is now available to watch....
EBSCON 2026: Crossroads Europe at a Turning Point a follow-up report
Graz/Villach, 9 October 2026. Europe is at a turning point when it comes to semiconductors, AI and strategic technologies. EBSCON, the leading trade fair for the European semiconductor and electronics industry, held in Graz on 7 October 2026, was therefore themed Crossroads Europe at a Turning Point. The central...
Equipping students and industry with practical RISC-V expertise
The 2026 edition of the SCCC course RISC-V on a chip in three days attracted a lot of applications from both students and employees at companies throughout Europe and beyond. A group of twenty participants were admitted and got to build their own physical RISC-V processors and run real hardware...
Open Calls
Open Access to FAMES Pilot Line
Opens:Mar 09, 2026 00:00 CET
Closes:Dec 31, 2026 23:59 CET
The FAMES Pilot Line accepts Spontaneous User Requests year-round, offering organisations rapid access to its advanced semiconductor technologies outside the annual Open-Access Calls. This pathway enables time-critical projects to move forward without waiting for the next call.
XECS Call 6
Opens:Jun 02, 2026 00:00 CET
Closes:Jan 21, 2027 17:00 CET
Xecs is an Eureka Cluster specifically designed to accelerate the pace of sustainable industrial innovation in the Electronics Components & Systems (ECS) community. Xecs intends to create an ambitious international collaboration programme. The resulting RD&I projects will generate high societal and economic impact for all those who participate in an Xecs project.
INFRACHIP Open Call to Free Access to State-of-the-Art Technologies
INFRACHIP is a European project under Horizon Europe Programme, offering distributed research infrastructure as a wider European research platform for the sustainable development of next-generation and future semiconductor chips.
Events
Chips Think Tank#8: Rethinking Advanced Packaging for Strategic Markets
Oct 28, 2026 12:00 CETOct 28, 2026 13:00 CET
WebinarOnline
As part of the **Chips Think Tank** webinar series, we are pleased to invite you to a discussion on how advanced packaging can serve strategic markets where volumes are limited and reliability requirements are exceptionally high. This session will feature **Wilfrid Aklamavo**, CTO of **SERMA Microelectronics**, one of Europes few OSATs...
Event hosted by
aCCCess Webinar on Technology Offers #4
Oct 29, 2026 10:00 CETOct 29, 2026 11:00 CET
Online
Integrated photonics is becoming a key enabling technology for the next generation of digital and deep-tech applications. But how do we turn PIC innovation into real-world technologies? The **PIXEurope Integrated Photonics Pilot Line** provides access to advanced capabilities across the PIC development pathway from fabrication and packaging to testing and...
Event hosted by
The Technology Sovereignty Package in Practice
Nov 04, 2026 12:00 CETNov 05, 2026 14:30 CET
Le Plaza Hotel Boulevard Adolphe Maxlaan 118/126, 1000 Brussels, Belgium
Five months after the launch of the European Union's Technology Sovereignty Package, the European semiconductor ecosystem will come together once again to assess the first developments, exchange perspectives and shape the next steps of Europe's technological journey. Taking place on 4-5 November 2026 in Brussels (Le Plaza Hotel, Adolphe Maxlaan 118/126,...
Event hosted by
Latest Trends
Infineon: World's first high-volume production facility for gallium nitride power semiconductors on 300-millimeter wafers built in Europe - Silicon Saxony
October 27, 2026. Infineon Technologies AG is building the world's first high-volume production facility for the latest generation of gallium nitride (GaN) power semiconductors on 300-millimeter wafers. As part of the project, Infineon is investing approximately €1.1 billion in existing cleanroom space at its Villach site by 2034. The simultaneous use of existing and modernized infrastructure enables a particularly efficient and cost-effective expansion of production capacity. Production is scheduled to start at the end of 2027. With this investment, Infineon is addressing the rapidly growing demand for high-performance power supply solutions. Gallium nitride enables significant efficiency gains in numerous applications such as AI data centers, energy infrastructure, electromobility, robotics, and consumer electronics.
NXP: Volkswagen Group strengthens its strategic semiconductor ecosystem through partnership with NXP - Silicon Saxony
October 26, 2026. The Volkswagen Group and NXP Semiconductors announced today, ahead of the International Automotive Suppliers Fair (IZB) in Wolfsburg, that they have agreed on a strategic partnership. NXP's S32K5 family of microcontrollers (MCUs) will serve as a key component of the Volkswagen Group's future software-defined vehicle (SDV) architecture and will support zonal control across all brands and vehicle segments. The first vehicle with the new architecture is planned for 2027.
Technology: Infineon invests more than one billion euros in Austria
The DAX-listed company is building a new production line for energy-saving chips made from the innovative material gallium nitride. The subsidies are substantial.
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.