
aCCCess (Alliance of Chips Competence Centres for Enhanced Semiconductor Services) is a four-year Coordination and Support Action launched in March 2025 under the EU Chips Act. It aims to build a strong, interconnected European Network of Chips Competence Centres (ENCCC) that enables innovation, facilitates access to advanced semiconductor services, and strengthens Europe’s position in the global semiconductor value chain.





Our network is comprised of Chip Competence Centers, Pilot lines and Design Platforms. Together, PLs and the DP empower the CCCs with cutting-edge infrastructure.
A Chips Competence Centre (CCC) is a hub of excellence providing access to specialised semiconductor knowledge, training, prototyping, testing, and small-scale production. These centres are pivotal to Europe's semiconductor strategy by:
Pilot Lines (PLs) are advanced manufacturing facilities that help scale innovations from research to production, enabling validation in relevant environments.
The Design Platform (DP) is a cloud-based virtual environment providing state-of-the-art Electronic Design Automation (EDA) tools and design libraries to:

First Annual Meeting of CCCs was held on 5-6 February in Brussels...

We are pleased to announce that the PIXSpain Competence Centre webpage is now fully available, providing a comprehensive overview of our role, activities, and ecosystem engagement within the photonics ecosystem....

Upskill yourself for free with the learning videos produced by the Austrian Chips Competence Center. The first are already available on YouTube and will later be part of a full online course....

Mar 16, 2026 12:00 CETMar 19, 2026 10:00 CET
Grenoble, France
The ChipNL Competence Centre is organizing an outbound business and innovation mission to Grenoble in March, one of Europe's key hubs for semiconductors and microelectronics.uitgaande business- en innovatiemissie naar Grenoble, een van Europas belangrijkste hubs voor halfgeleiders en micro-elektronica. This mission combines participation in the Minalogic Business Meetings with on-site visits...
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Mar 17, 2026 09:00 CETMar 17, 2026 17:00 CET
France - GrenobleGrenoble
Whether you are a decision-maker or a provider of digital solutions, meet your future partners, identify new business opportunities, and expand your network through targeted connections. ### Why take part? - Are you looking to integrate AI into your HR processes? - Do you want to digitalize your factory to improve performance? - Are...
Event hosted by

Mar 24, 2026 14:00 CETMar 24, 2026 15:00 CET
Webinar
Working on semiconductor research or early-stage chip development in Europe? Then this upcoming webinar by Silicon Saxony might be highly relevant for you. The session will introduce INFRACHIP (https://infrachip.eu/) an EU-funded platform designed to open up advanced semiconductor research infrastructure across Europe. Heres what it offers: - Free access to state-of-the-art infrastructure...
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Samsung Electronics is reportedly planning to adopt a 2-nanometer (nm) process for the base die of its next-generation high-bandwidth memory (HBM), HBM4E, aiming to enhance its technological competitiveness. Industry experts see this as part of Samsung's broader strategy to leverage its advantage as a leading integrated device manufacturer (IDM) in the global AI semiconductor race.

The ten largest semiconductor foundries exceeded $169.5 billion in 2025, driven by AI.

VivaTech, one of Europe's largest events for startups and technology, has published the new edition of the ranking "Top 100 Rising European Startups". The

aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.