
aCCCess (Alliance of Chips Competence Centres for Enhanced Semiconductor Services) is a four-year Coordination and Support Action launched in March 2025 under the EU Chips Act. It aims to build a strong, interconnected European Network of Chips Competence Centres (ENCCC) that enables innovation, facilitates access to advanced semiconductor services, and strengthens Europe’s position in the global semiconductor value chain.





Our network is comprised of Chip Competence Centers, Pilot lines and Design Platforms. Together, PLs and the DP empower the CCCs with cutting-edge infrastructure.
A Chips Competence Centre (CCC)is a hub of excellence providing access to specialised semiconductor knowledge, training, prototyping, testing, and small-scale production. These centres are pivotal to Europe's semiconductor strategy by:
Pilot Lines (PLs) are advanced manufacturing facilities that help scale innovations from research to production, enabling validation in relevant environments.
The Design Platform (DP) is a cloud-based virtual environment providing state-of-the-art Electronic Design Automation (EDA) tools and design libraries to:

The first webinar of the aCCCess Webinar Series on Technology Offers featured the APECS Pilot Line, showcasing its advanced packaging and heterogeneous integration capabilities under the EU Chips Act. The session highlighted collaboration with the ChipNL Competence Centre and explored how joint efforts support innovation, industry uptake, and the strengthening...

Exploring the Future of Investment in Deeptech & Photonics ...

On 23-24 March, the Chips from the North event in Helsinki, organised by FiCCC, brought together Europe's semiconductor community to explore available support for companies across the value chain....

Opens:Apr 01, 2026 00:00 CET
Closes:Jun 30, 2026 23:59 CET
The APECS Pilot Line launches it's first annual Open Access Calls!
As part of the APECS pilot lines broader access strategy, the annual Open Access Calls invite players across the semiconductor value chain to submit project ideas for selected pilot line technologies. The calls provide structured, guided, and transparent access to APECS modern R&D infrastructure, enabling companies, RTOs and universities to validate concepts, accelerate development, and collaborate directly with APECS experts.

Opens:Mar 09, 2026 00:00 CET
Closes:Dec 31, 2026 23:59 CET
The FAMES Pilot Line accepts Spontaneous User Requests year-round, offering organisations rapid access to its advanced semiconductor technologies outside the annual Open-Access Calls. This pathway enables time-critical projects to move forward without waiting for the next call.
INFRACHIP is a European project under Horizon Europe Programme, offering distributed research infrastructure as a wider European research platform for the sustainable development of next-generation and future semiconductor chips.

May 19, 2026 08:30 CETMay 20, 2026 18:30 CET
Antwerp, BelgiumKoningin Astridplein 20-26, 2018 - Antwerp, Belgium
Discover the future of AI at ITF world The race toward the next frontier in artificial intelligence is making daily headlines. But reaching next-gen AI isn't a sprint; it's a marathon. The rewards will be shared by humanity: applications that far exceed anyone's imagination, in domains such as healthcare, mobility, and...
Event hosted by

May 19, 2026 13:00 CETMay 19, 2026 14:00 CET
Online
Livestream will cover An overview of the rapidly evolving open-source IC design landscape, driven by new PDKs and toolchains Real mixed-signal design examples, from ADCs to SoCs and mm-wave chips, built using open-source flows A practical case study of a commercial-grade ASIC developed from concept to silicon...
Event hosted by

May 20, 2026 08:15 CESTMay 22, 2026 15:00 CEST
University of Southern Denmark (SDU)Campusvej 55, 5230 Odense, Denmark
A 3-day course combining theory with practical design insights and hands-on exercises, aimed at M.Sc./Ph.D. students, engineers in SMEs, and experienced IC designers. Participants will gain a practical understanding of amplifier design, with a strong emphasis on real-world design methodologies for translating specifications into robust circuit solutions. ...
Event hosted by


LOK Report is a European news magazine for railway enthusiasts.

The global semiconductor materials market reached a record high of US$73.2 billion in 2025, up 6.8% year-over-year, according to the latest Materials Market Data Subscription (MMDS) report released by SEMI on May 13, 2026.

aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.