Building a stronger European semiconductor ecosystem with the European Network of Chips Competence Centers
About aCCCess
aCCCess (Alliance of Chips Competence Centres for Enhanced Semiconductor Services) is a four-year Coordination and Support Action launched in March 2025 under the EU Chips Act. It aims to build a strong, interconnected European Network of Chips Competence Centres (ENCCC) that enables innovation, facilitates access to advanced semiconductor services, and strengthens Europe’s position in the global semiconductor value chain.
Network
Our network is comprised of Chip Competence Centers, Pilot lines and Design Platforms. Together, PLs and the DP empower the CCCs with cutting-edge infrastructure.
What is a Competence Center?
A Chips Competence Centre (CCC)is a hub of excellence providing access to specialised semiconductor knowledge, training, prototyping, testing, and small-scale production. These centres are pivotal to Europe's semiconductor strategy by:
- Supporting SMEs and start-ups with innovation services
- Bridging the gap between research and industry
- Promoting regional and pan-European know-how in chips and microelectronics
What is a Pilot Line & a Design Platform?
Pilot Lines (PLs) are advanced manufacturing facilities that help scale innovations from research to production, enabling validation in relevant environments.
The Design Platform (DP) is a cloud-based virtual environment providing state-of-the-art Electronic Design Automation (EDA) tools and design libraries to:
- Accelerate chip design and prototyping
- Enable collaboration across Europe
- Support education and skills development in semiconductor design
Latest News
The Dutch semiconductor ecosystem: more than one success story
The Netherlands is known for one semiconductor success story, but it is home to many. A new factsheet from ChipNL CC, part of the European network of Chips Competence Centres, maps a complete ecosystem of 58,000 people and EUR 33.6 billion in value across the full value chain....
The European Semiconductor industry comes together: The HCHiP Collaboration Days in Budapest were a success!
The purpose of the international conference was to enhance creating a competitive semiconductor ecosystem in Hungary. The mission of HCHiP event focuses on transforming knowledge into real industrial value. Moreover, we declared the HCHiP is not a single research project, but a long-term strategic ecosystem program. That is precisely why...
Riga Chip Summit 2026: Strengthening Europes Semiconductor Ecosystem
On 13 May 2026, the Latvian Chip Competence Centre hosted the Riga Chip Summit 2026, the first-ever semiconductor-focused summit in Latvia. The event marked a significant milestone for the Baltic and European semiconductor landscape, bringing together over 200 participants from 23 countries, including industry leaders, researchers, startups, investors, policymakers, and...
Open Calls
APECS Open Access Call
Opens:Apr 01, 2026 00:00 CET
Closes:Jun 30, 2026 23:59 CET
The APECS Pilot Line launches it's first annual Open Access Calls!
As part of the APECS pilot lines broader access strategy, the annual Open Access Calls invite players across the semiconductor value chain to submit project ideas for selected pilot line technologies. The calls provide structured, guided, and transparent access to APECS modern R&D infrastructure, enabling companies, RTOs and universities to validate concepts, accelerate development, and collaborate directly with APECS experts.
Open Access to FAMES Pilot Line
Opens:Mar 09, 2026 00:00 CET
Closes:Dec 31, 2026 23:59 CET
The FAMES Pilot Line accepts Spontaneous User Requests year-round, offering organisations rapid access to its advanced semiconductor technologies outside the annual Open-Access Calls. This pathway enables time-critical projects to move forward without waiting for the next call.
XECS Call 6
Opens:Jun 02, 2026 00:00 CET
Closes:Jan 21, 2027 17:00 CET
Xecs is an Eureka Cluster specifically designed to accelerate the pace of sustainable industrial innovation in the Electronics Components & Systems (ECS) community. Xecs intends to create an ambitious international collaboration programme. The resulting RD&I projects will generate high societal and economic impact for all those who participate in an Xecs project.
Events
Webinar on XECS Matchmaking Event
Jun 23, 2026 14:00 CESTJun 23, 2026 15:00 CEST
Webinar
Xecs is an Eureka Cluster specifically designed to accelerate the pace of sustainable industrial innovation in the Electronics Components & Systems (ECS) community. Xecs intends to create an ambitious international collaboration programme. The resulting RD&I projects will generate high societal and economic impact for all those who participate in an...
Event hosted by
FAMES technical Workshop - LID World Summit 2026
Jun 24, 2026 09:30 CETJun 24, 2026 11:30 CET
Grenoble, FRANCE
Semiconductor makers, startups, fabless companies and academic researchers will soon benefit from the pilot lines breakthroughs in high-performance, low-power chips. Learn how you can adapt FAMES FD-SOI 10-and-7nm process technologies, embedded NVMs, 3D integration, RF components, and power-management IC solutions for your own innovations....
Event hosted by
Deeptech Investment: aligning risks, opportunities and expectations
Jun 25, 2026 17:00 CETJun 25, 2026 18:00 CET
Webinar
Eric Benhamou (Founder & General Partner, Benhamou Global Ventures), George Ugras (Managing Director, AV8 Ventures and Chairman of INPHO Venture Summit), Jean Schmitt (President & Managing Partner, Jolt Capital) and Reza Malekzadeh (General Partner, Partech), will bring perspectives from seed to growth and from some of the most consequential deeptech...
Event hosted by
Latest Trends
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Rapidus Completes 150 Billion Yen Funding Round from Japan Government - IMAPS 3D InCites Content Platform
Rapidus Corporation today announced that it has completed an additional funding round of 150 billion yen (equivalent to $943 million USD) from the Information-Technology Promotion Agency (IPA), Japan, an independent administrative agency under the jurisdiction of the Ministry of Economy, Trade and Industry (METI) based on the “Act on Facilitation of Information Processing.”
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.