
aCCCess (Alliance of Chips Competence Centres for Enhanced Semiconductor Services) is a four-year Coordination and Support Action launched in March 2025 under the EU Chips Act. It aims to build a strong, interconnected European Network of Chips Competence Centres (ENCCC) that enables innovation, facilitates access to advanced semiconductor services, and strengthens Europe’s position in the global semiconductor value chain.



Our network is comprised of Chip Competence Centers, Pilot lines and Design Platforms. Together, PLs and the DP empower the CCCs with cutting-edge infrastructure.
A Chips Competence Centre (CCC) is a hub of excellence providing access to specialised semiconductor knowledge, training, prototyping, testing, and small-scale production. These centres are pivotal to Europe's semiconductor strategy by:
Pilot Lines (PLs) are advanced manufacturing facilities that help scale innovations from research to production, enabling validation in relevant environments.
The Design Platform (DP) is a cloud-based virtual environment providing state-of-the-art Electronic Design Automation (EDA) tools and design libraries to:

FirstAnnual Meeting of CCCs was held on 5-6 February in Brussels...

We are pleased to announce that the PIXSpain Competence Centre webpage is now fully available, providing a comprehensive overview of our role, activities, and ecosystem engagement within the photonics ecosystem....

Upskill yourself for free with the learning videos produced by the Austrian Chips Competence Center. The first are already available on YouTube and will later be part of a full online course....

Feb 19, 2026 10:00 GMTFeb 19, 2026 12:00 GMT
Online
As demand for semiconductors surges driven by AI and next-generation technologies Europe faces rising design costs, scaling challenges, and investment gaps. Startup-led innovation has never been more critical. The first session of the POEMS Webinar Series welcomes Sean Redmond and Patrick Camilleri (Silicon Catalyst.EU) to explore the forces reshaping...
Event hosted by

Feb 23, 2026 16:00 CETFeb 25, 2026 18:30 CET
Universitat Politecnica de Valencia (UPV), Ciudad Politecnica de la Innovacion, Valencia-Spain Campus de Vera, Camino de Vera, s/n. Building 8B , Blue Cube, Access M/N , 3rd floor Auditorium
The Photonic Integration week has been a key meeting point for the international integrated photonics community, bringing together experts from academia, research organizations, industry, and government. The event fosters collaboration and discussion around integrated photonics, therefore PIW is where the photonics ecosystem comes together. During the event, there will also be...
Event hosted by

Feb 26, 2026 13:00 CETFeb 26, 2026 14:00 CET
Webinar
## Europes Quantum Momentum: From National Ecosystems to European Pilot Lines As part of the **Chips Think Tank webinar series**, aCCCess is pleased to invite you to a high-level discussion on the future of quantum technologies in Europe. This session will feature **Pekka Pursula, VP Microelectronics and Quantum Technology at VTT Finland**,...
Event hosted by

The global system on chip SoC market was valued at US 151 8 Bn in 2021 and is projected to expand at a compound annual growth rate CAGR of 8 1 from 2022 to 2031 reaching an estimated US 317 ...

According to and , Qualcomm Technologies has completed the tape-out of its 2-nanometre semiconductor design with significant contributions from its engineering centres in India, underscoring the country's rising importance in the global race toward next-generation chip technologies and aligning with New Delhi's push to strengthen domestic semiconductor design capabilities.

Texas Instruments (TI) recently announced that it will acquire IoT wireless connectivity specialist Silicon Labs for US$7.5 billion, with the deal expected to be completed in the first half of 2027. The announcement surprised the market, as it marks TI's largest acquisition since its purchase of National Semiconductor in 2011.

aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.