Building a stronger European semiconductor ecosystem with the European Network of Chips Competence Centers
About aCCCess
aCCCess (Alliance of Chips Competence Centres for Enhanced Semiconductor Services) is a four-year Coordination and Support Action launched in March 2025 under the EU Chips Act. It aims to build a strong, interconnected European Network of Chips Competence Centres (ENCCC) that enables innovation, facilitates access to advanced semiconductor services, and strengthens Europe’s position in the global semiconductor value chain.
Network
Our network is comprised of Chip Competence Centers, Pilot lines and Design Platforms. Together, PLs and the DP empower the CCCs with cutting-edge infrastructure.
What is a Competence Center?
A Chips Competence Centre (CCC)is a hub of excellence providing access to specialised semiconductor knowledge, training, prototyping, testing, and small-scale production. These centres are pivotal to Europe's semiconductor strategy by:
- Supporting SMEs and start-ups with innovation services
- Bridging the gap between research and industry
- Promoting regional and pan-European know-how in chips and microelectronics
What is a Pilot Line & a Design Platform?
Pilot Lines (PLs) are advanced manufacturing facilities that help scale innovations from research to production, enabling validation in relevant environments.
The Design Platform (DP) is a cloud-based virtual environment providing state-of-the-art Electronic Design Automation (EDA) tools and design libraries to:
- Accelerate chip design and prototyping
- Enable collaboration across Europe
- Support education and skills development in semiconductor design
Latest News
Chips from the North: Connecting Design and Manufacturing in Europe
On 23-24 March, the Chips from the North event in Helsinki, organised by FiCCC, brought together Europe's semiconductor community to explore available support for companies across the value chain....
ENCCC Annual Meeting: Strengthening Europes Semiconductor Network
First Annual Meeting of CCCs was held on 5-6 February in Brussels...
PIXSpain Competence Centre Webpage Content Available
We are pleased to announce that the PIXSpain Competence Centre webpage is now fully available, providing a comprehensive overview of our role, activities, and ecosystem engagement within the photonics ecosystem....
Open Calls
EuroCDP Venture Development Programme
Opens:Apr 08, 2026 00:00 CEST
Closes:May 01, 2026 17:00 CEST
The EuroCDP launched its Venture Building Programmes, a dedicated acceleration and incubation track designed to help European fabless startups move faster, design smarter, and validate their first silicon with confidence.
CHIPS JU ECS Calls
Closes:May 07, 2026 17:00 CET
The Chips JU has two open calls for proposals under its Electronic Components & Systems (ECS) programme, funded through Horizon Europe. Deadline for project outline is 7 May 2026!
Chips Venture Forum 2026
Opens:Mar 17, 2026 09:00 CET
Closes:May 12, 2026 18:00 CET
The 2026 edition of the Chips Venture Forum will introduce an enhanced format designed to maximize interactions with investors and increase visibility across the semiconductor ecosystem.
Events
Highlights for a sustainable semiconductor industry
Apr 29, 2026 13:00 EESTApr 29, 2026 16:00 EEST
VTT MicronovaTietotie 3, 02150 Espoo
This event will bring together experts and stakeholders to explore key developments and challenges about sustainability in the semiconductor industry. ...
Event hosted by
Riga Chip Summit 2026
May 13, 2026 08:30 EESTMay 13, 2026 17:00 EEST
Riga, Latvia at the VEF Kamerzale Spidola. Ieriku str. 5A, Riga, Latvia
**Riga Chip Summit 2026** is the first chip dedicated summit in Latvia organised by the Latvian Chip Competence Centre (LCCC). The summit will bring together stakeholders from industry, academia, finance, competence centres, start-ups, and SMEs from the NordicBaltic region and the wider European ecosystem. The event aims to explore opportunities,...
Event hosted by
Czech Semicon Days 2026
May 18, 2026 10:00 CETMay 22, 2026 16:00 CET
PragueWilsonova 300/8, Vinohrady, 110 00 Praha-Praha 2, Czechia
Join us at Czech Semicon Days 2026, one of the key events for the semiconductor sector in Central Europe. From 18th May 2026 in Prague, industry leaders, researchers, investors and policymakers will come together to discuss the future of semiconductors and their role in next-generation mobility, autonomous systems and electrification. The programme...
Event hosted by
Latest Trends
ON Semiconductor and NIO expand strategic cooperation to advance the development of the next-generation 900V electric vehicle platform
According to ON Semiconductor, ON Semiconductor announced today that it will further expand its strategic cooperation with Nio to jointly promote the development of the next-generation electric vehicle platform. Based on years of collaboration, the two parties will work more closely together, with ON Semiconductor providing the latest EliteSiC M3e technology to accelerate Nio's transition from a 400V to a 900V architecture
From NVIDIA AI error correction to Cisco targeting "quantum interconnection," the quantum frenzy is making huge waves again! Tech giants are competing for the commercialization of quantum computing
Quantum computing is becoming a technology hotspot sought after by global capital. Cisco has showcased a high-performance switching chip designed to connect different types of quantum computers, promoting the commercialization of quantum computing. Unlike companies like Google and IBM, Cisco has chosen to collaborate with other participants rather than manufacture its own quantum computers. At the same time, NVIDIA has launched the world's first family of open-source AI models for quantum computing, Ising, aimed at addressing key issues in quantum processor calibration and quantum error correction
Bull teams up with Equal1 to advance hybrid quantum tech
Evertiq: Your Source for Electronics Manufacturing News & Industry Expos. Stay updated with breaking news and discover upcoming expos.
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.