Open Calls

INFRACHIP is a European project under Horizon Europe Programme, offering distributed research infrastructure as a wider European research platform for the sustainable development of next-generation and future semiconductor chips.

The European Chip Design Platform EuroCDP is looking for industry professionals, technical experts, senior executives, founders, investment partners and experienced practitioners who want to help shape the next generation of European IC design startups.

The FAMES Pilot Line accepts Spontaneous User Requests year-round, offering organisations rapid access to its advanced semiconductor technologies outside the annual Open-Access Calls. This pathway enables time-critical projects to move forward without waiting for the next call.

The APECS Pilot Line launches it's first annual Open Access Calls!

As part of the APECS pilot lines broader access strategy, the annual Open Access Calls invite players across the semiconductor value chain to submit project ideas for selected pilot line technologies. The calls provide structured, guided, and transparent access to APECS modern R&D infrastructure, enabling companies, RTOs and universities to validate concepts, accelerate development, and collaborate directly with APECS experts.

The 2026 edition of the Chips Venture Forum will introduce an enhanced format designed to maximize interactions with investors and increase visibility across the semiconductor ecosystem.

The Chips JU has two open calls for proposals under its Electronic Components & Systems (ECS) programme, funded through Horizon Europe. Deadline for project outline is 7 May 2026!

The EuroCDP launched its Venture Building Programmes, a dedicated acceleration and incubation track designed to help European fabless startups move faster, design smarter, and validate their first silicon with confidence.