Events
aCCCess Webinar on Technology Offers #4
Integrated photonics is becoming a key enabling technology for the next generation of digital and deep-tech applications. But how do we turn PIC innovation into real-world technologies?
The **PIXEurope Integrated Photonics...
The Technology Sovereignty Package in Practice
Five months after the launch of the European Union's Technology Sovereignty Package, the European semiconductor ecosystem will come together once again to assess the first developments, exchange perspectives and shape...
SEMICON Europa: ITF Chip into the Future
Europe's next era: Navigating the perfect storm SEMICON Europa 2026 is co-located with electronica in Munich, Germany creating the strongest single event for electronics manufacturing in Europe, and broadening the...
Ferrite Circulators: Theory, Design and Simulation
The on-site training provides a comprehensive exploration of the theoretical foundations and practical considerations underlying ferrite circulators. It begins with an in-depth discussion of the magnetic properties that govern their...
NanoIC Winter School on Embedded Memories
The NanoIC European Winter School on Embedded Memories offers a deeper dive into one of the key technologies underpinning modern microelectronics. Over two days at imec in Leuven, participants will...
CHIPNATION 2026
Chipnation aims to strengthen and connect the Spanish & European semiconductor ecosystem by creating a platform where industry, academia, and institutions can collaborate more effectively. Its value lies in bringing...
Expert Metrology Course
The Expert Metrology Course is a two-day training event dedicated to advanced characterization and metrology measurement methods for semiconductor materials, structures and devices. Organized by the Center for Surface Science...
6th Emerging Tech Forum
The 6th edition of HETiA's flagship deep tech forum returns this December, organized within the framework of the Hellenic Chips Competence Centre (HCCC). Taking place on December 17th in Athens,...
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.