Power module characterization and testing
The course covers advanced characterization and reliability testing of power semiconductor modules. Focus is placed on static/dynamic electrical measurements, thermal profiling, and failure mechanisms under stress.
Level
Intermediate
Delivery Mode
In person
Language
English
Dates
1 Jul 2026
Duration
4-5 days
Learning hours
0
ECTS
0.00
ECVET
0.00
Seats
Limited (5)
Location
Ilkovicova 3, Bratislava, Slovakia
Fees
no fees
Delivered by
Slovak University of Technology
Chips Competence Centre
SK Chips CC
Certification Type
Certificate of Attendance
Target Audience
Graduate students
Pre-requisites
Basics of circuit theory, semiconductor physics, electrical measurements and instrumentation
Categories
Device PhysicsQuality and ReliabilityCharacterization and Test
Registration Contact
Register Now
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.