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Infineon: World's first high-volume production facility for gallium nitride power semiconductors on 300-millimeter wafers built in Europe - Silicon Saxony

27.10.2026

October 27, 2026. Infineon Technologies AG is building the world's first high-volume production facility for the latest generation of gallium nitride (GaN) power semiconductors on 300-millimeter wafers. As part of the project, Infineon is investing approximately €1.1 billion in existing...

NXP: Volkswagen Group strengthens its strategic semiconductor ecosystem through partnership with NXP - Silicon Saxony

27.10.2026

October 26, 2026. The Volkswagen Group and NXP Semiconductors announced today, ahead of the International Automotive Suppliers Fair (IZB) in Wolfsburg, that they have agreed on a strategic partnership. NXP's S32K5 family of microcontrollers (MCUs) will serve as a key...

Technology: Infineon invests more than one billion euros in Austria

27.10.2026

The DAX-listed company is building a new production line for energy-saving chips made from the innovative material gallium nitride. The subsidies are substantial.

From crystal to new 2D materials space: New method enables the study of nanostructures beyond classic layered systems

27.10.2026

Two-dimensional materials can exhibit properties that do not occur in their three-dimensional parent systems, making them particularly interesting for applications in electronics, for example. So far, the search mainly concentrated on crystals that were already composed of loosely bonded layers....

Can you explain quantum sensors to me as simply as possible and their practical uses in regular life?

27.10.2026

TSMC’s AI Chip Packaging Prices Could Jump 20%

27.10.2026

Taiwan Semiconductor Manufacturing (TSMC) ($TSM) is reportedly preparing to raise prices for its CoWoS advanced chip packaging services by up to 20...

Tiny Quantum Breakthrough with Big Implications for Medicine and Technology | Newswise

27.10.2026

Adelaide University quantum engineers have solved a long-standing problem in physics that could help advance brain imaging, medical diagnostics, and other fields that use quantum sensors. The researchers have found a new way to improve some of the world's most...

EU sets out a new Strategy for the Arctic

20.10.2026

Today, the European Commission and the High Representative of the Union for Foreign Affairs and Security Policy presented a new Strategy for the Arctic.

A quantum computing feat brings the ‘megaquops’ era a step closer

20.10.2026

Error correction creates qubits that glitch only 5 out of a million times, the first step toward a new phase for quantum computing.

NTT and partners to develop optical chiplet as part of Japanese R&D project

20.10.2026

NTT has announced an R&D partnership with its Innovative Device subsidiary, Furukawa Electric, Shinko Electric Industries, and Japan Semiconductor. The partnership aims to establish commercial production of an innovative optical chiplet built for data transport in state-of-the-art AI and computing...

I sold my apartment, cashed out my pension, and took on debt to build a semiconductor startup. I'd do it again.

20.10.2026

Hans Hasselby-Andersen quit his engineering job during the 2008 financial crisis with four kids and spent a year raising his first funding.

Thermally Conductive Insulators Market Size, Share, and Trends - Global Forecast 2026-2032 | EVs, AI Data Centers, and Power Electronics Drive Growth to USD 1.03 Billion

12.10.2026

"Thermally Conductive Insulators Market - Global Forecast 2026-2032" has been added to ResearchAndMarkets.com's offering.

Entering the mainstream 8-inch SiC market! Guangyun's subsidiary, Shengxin Materials, will be listed on the Emerging Stock Market on October 15th.

12.10.2026

Guangyun Group's subsidiary, Shengxin Materials, is expected to be listed on the Emerging Stock Market on October 15th. As N-type conductive SiC products have entered the mainstream 8-inch form factor, the company is currently mass-producing 6-inch and 8-inch conductive and...

Powering the AI revolution: Inside the grid, thermal, and interconnect challenges limiting data center growth

11.10.2026

We take a deep dive into the electrical, thermal, and infrastructural bottlenecks affecting the next-generation computing revolution.

ROHM SiC Chips Power BMW New Class EV

11.10.2026

ROHM's SiC power chips support efficiency, performance and reliability in BMW's Neue Klasse electric vehicle powertrain, the company announces.

Tesla, LG, and "Hitachi" are on the same list: The Hitachi that passed Nvidia's energy storage certification isn't your Hitachi, but it does answer the question, "Is Hitachi nearing its end?"

11.10.2026

Nvidia's first batch of certified energy storage companies has been circulating again in tech circles and stock forums these past few days: Tesla, Hitachi, and LG. What's causing Chinese users to frown is the "Hitachi" – their first reaction is...

IBM's 100-qubit quantum chip has completed 5,000 error-correction operations

10.10.2026

IBM tested a quantum processor where 100 qubits were measured and reset nearly 5,000 times during a calculation, demonstrating a sharp transition from chaos to a controlled state.

GF Unveils Roadmap to Deliver the World’s Most Advanced FD-SOI Platform for Physical AI - Semiconductor Digest

09.10.2026

New FDX Fusion platform extends GF’s FD-SOI leadership as the first process technology in Europe to deliver single-digit nanometer digital performance optimized for the physical world.

The AI Packaging Opportunity Extends Beyond TSMC

09.10.2026

GlobalFoundries’ manufacturing agreement, Intel’s integration capabilities, and the development of glass substrates reveal different ways to participate in AI semiconductor spending.

Photonic circuits become trainable AI hardware - Nature Computational Science

09.10.2026

A physics-based in situ learning method is demonstrated that directly measures optical gradients with photonic integrated circuits, allowing diverse circuit topologies to be trained after fabrication. This hardware achieves matrix design, multiwavelength computation and rapid meta-learning without requiring a full...

aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.

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