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Latest Trends

STMicroelectronics extends availability of SPC58 automotive microcontrollers to 2041

09.09.2025

The SPC58 MCUs offer advanced features for automotive applications, ensuring increased product lifespan and enhanced control for new designs

Semiconductors: Scintil Photonics raises 50 million euros

09.09.2025

Scintil Photonics today announced a €50 million Series B funding round, notably from US chip giant Nvidia.

2D Materials Market Set to Reach USD 3.44 Billion by 2032, Driven by Emerging Applications

31.07.2025

2D Materials Market size was valued at USD 2 53 Billion in 2024 and the total 2D Materials revenue is expected to grow at a CAGR of 3 9 from 2025 to 2032 reaching nearly USD 3 44 Billion 2D...

STMicroelectronics Acquires MEMS Sensor Division from NXP

31.07.2025

(Bild: STMicroelectronics) STMicroelectronics (ST) plans to spend nearly one billion US dollars for the MEMS sensor division of semiconductor manufacturer NXP. The transaction is expected to complement ST's product portfolio and open up new development opportunities in the automotive and...

Infineon licenses auto IP to Skywater | Electronics Weekly

30.07.2025

SkyWater, the US foundry, has licensed a library of silicon-proven, mixed-signal ASIC design IP from Infineon. The IP enables Skywater’s customers to

Materials Engineering for Light‐Activated Gas Sensors: Insights, Advances, and Future Perspectives

29.07.2025

Advanced Materials, EarlyView.

Integration of Lateral Si/SiGe HBTs on Advanced FD-SOI Technology: Process Development and Challenges

16.07.2025

This paper presents an integration of a lateral Si/SiGe heterojunction bipolar transistor (LHBT) device on an advanced Fully-Depleted-Silicon-On-Insulator (FD-SOI) Complementary Metal-Oxide Semiconductor (CMOS) process flow accompanied by a Technology Computer Aided Design (TCAD) study. The analysis is based on physics...

To seize market share! Huawei plans to redesign AI chips from ASIC to GPGPU | United News Network

12.07.2025

Huawei, a Chinese technology giant, is seeking to change its artificial intelligence chip design strategy from application-specific integrated circuits (ASICs) to general-purpose graphics processing units (GPGPUs),...

Embedded Non Volatile Memory Market Size to Hit USD 13.03 Bn by 2034

18.06.2025

The adoption of eNVM is being further accelerated by the move toward IoT devices, AI edge computing, and smart wearables. Why is the Demand for …

aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.

Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.