



Taiwan Semiconductor Manufacturing Company (TSMC) anticipates a sustained, vigorous demand for artificial intelligence (AI) chips over the coming years, coinciding with its escalation of investments in Arizona. The semiconductor giant's strategic move involves bolstering its presence in the United States...
Generative AI is accelerating demand for computing power, memory and data bandwidth, shifting semiconductor innovation beyond front-end processes toward advanced packaging, silicon photonics (SiPh) and Co-Packaged Optics (CPO). Benjamin Hein, CEO Electronics and Executive Board member at Merck, said advanced...
Swissbit AG and Nexperia B.V. today (9 July) confirmed their collaboration on secure, high‑reliability platforms for AI, cloud and server applications. By combining Swissbit’s secure storage expertise with Nexperia’s semiconductor building blocks, the two companies support customers developing and scaling...

aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.