From Wafers to Chips to Components
Introduces wafer processing, chip handling, packaging, assembly, and electrical interconnection techniques for semiconductor devices.
Level
Introductory
Delivery Mode
Hybrid
Language
Portuguese
Dates
1 Nov 2026 – 30 Nov 2026
Learning hours
0
ECTS
0.00
ECVET
0.00
Seats
Limited (20)
Location
https://www.poemscentre.eu/en/learning-portal
Fees
no fees
Delivered by
INESC MN and INL
Chips Competence Centre
POEMS
Certification Type
Certificate of Attendance
Target Audience
Recent graduates
Pre-requisites
Basic knowledge
Categories
Manufacturing
Registration Contact
Register Now
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.