Design of Printed Circuit Boards and Printed Board Assembly
Participants will explore the design and fabrication of PCBs and printed board assembly, with a strong focus on Reliability, Signal Integrity, Power Integrity, EMC and EMI. The program combines both theory and hands-on lab sessions where participants can perform their own measurements.
Level
Intermediate
Delivery Mode
In person
Language
English
Dates
2 Oct 2026 – 27 Nov 2026
Duration
6 course days + evaluation
Learning hours
48
ECTS
0.00
ECVET
0.00
Seats
Limited (20)
Location
Department of Electrical Engineering (ESAT), Kasteelpark Arenberg 10, 3001 Heverlee, Belgium
Fees
3600 (waiver possible)
Delivered by
KU Leuven
Chips Competence Centre
FC3
Certification Type
Micro-credentials
Target Audience
Graduate students
Pre-requisites
Participants must have a Bachelor or a Master in a technical field, or equivalent through professional work experience
Categories
ManufacturingQuality and ReliabilityCharacterization and TestIC Design
Registration Contact
Register Now
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.