APECS Open Access Call
DESCRIPTION
Pathway to high-performance, low-power chips As part of the APECS pilot lines broader access strategy, the annual Open Access Calls invite players across the semiconductor value chain to submit project ideas for selected pilot line technologies. The calls provide structured, guided, and transparent access to APECS modern R&D infrastructure, enabling companies, RTOs and universities to validate concepts, accelerate development, and collaborate directly with APECS experts.
A wide range of selected APECS technologies is available at:
Annual Open-Access Call No 1 Opening: April 1st 2026 Closing: June 30th 2026 at 23h59 CET (deadline for submissions)
Selected APECS Technologies:
- CTR Services
- Integration & Packaging Technologies
- Multi Project Wafer (MPW) Runs
- Imaging Technologies, Post-CMOS Photonic Platform & IPD planar components
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.