Trainees will learn the basics of SEM and FIB, including electron beam lithography, chip cross-section analysis, EDS and STEM. The training also covers 3D FIB tomography at the nanometre scale and includes hands-on FIB work under instructor supervision.

aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.