Chips Venture Forum
Where Europe's semiconductor start-ups meet the capital to scale
The Chips Venture Forum™ brings the most promising start-ups from Europe's Chips Competence Centres, the EIC and EuroCDP portfolio before the investors, corporates and institutions active in semiconductors. In 2026: CVF Selection in Bordeaux on 21–22 October, and the CVF Final in Munich on 11 November during SEMICON Europa.
Why the Chips Venture Forum
From European research to semiconductor companies that scale
The Chips Venture Forum™ is an activity of the aCCCess programme dedicated to creating the conditions for investment in the European semiconductor ecosystem. It is operated by Blumorpho and organised with the support of the European Commission, within the aCCCess project, the European Innovation Council (EIC) and EuroCDP.
Europe has a strong semiconductor research base and a growing generation of deeptech founders. The Forum gives the start-ups supported by the Chips Competence Centres a direct path to the investors and industrial partners able to scale them, across the entire value chain.
Build a high-quality deal flow
Start-ups affiliated with a European Chips Competence Centre, backed by the EIC or EuroCDP, selected by a jury of investors and industry experts.
Federate semiconductor investors
Venture capital, corporate venture and growth funds whose investment thesis includes semiconductors.
Accelerate adoption
Direct exchanges with semiconductor corporates, equipment makers, system integrators and end-users, and with decision-makers from the European Commission and the EIC.
How it works
A selection in three steps
Ahead of the events · Online
Applications & digital sessions
Applications are submitted through the Chips Competence Centres, the EIC and EuroCDP. Selected companies take part in digital one-to-one sessions with investors aligned with their investment thesis, so that each conversation in Bordeaux starts from work already done.
Phase 1 · 21–22 October 2026
CVF Selection · Bordeaux
Two half-days at the Palais de la Bourse, alongside the INPHO Venture Summit. 60 companies selected for investor meetings are invited to present their company: all hold one-to-one meetings with investors and take part in the investor dialogue, and 36 of them pitch live in 12 market panels.
INPHO Venture SummitPhase 2 · 11 November 2026
CVF Final · Munich
Four pitch sessions with 21 companies at Messe München during SEMICON Europa, co-located with electronica. Semiconductor groups, equipment makers and system integrators in the room, dedicated one-to-one meeting spaces, and the CVF Award.
SEMICON Europa2026 selection
Meet the 2026 companies
62 semiconductor start-ups selected for investor meetings, across 12 market categories: photonics, AI/ML hardware, MEMS & sensors, mainstream silicon, RF & mmWave, quantum, test & instrumentation, process equipment, power electronics, materials & substrates, packaging & assembly, and EDA & design automation.
Agate Sensors
AGATE Sensors develops software‑defined spectral sensing technology that enables hyperspectral imaging on mass‑market consumer devices. Our solution combines custom sensor architectures with computational imaging and signal‑processing software to extract rich spectral information using low‑cost, compact hardware suitable for drones, CUAS, smartphones, wearables, and edge devices.
AiQUOS
AiQUOS develops multiparametric electrochemical smart probes for real-time monitoring of aqueous media. Our core innovation is a proprietary neuromorphic ASIC (~1 mm² CMOS) embedded directly inside the probe, enabling continuous, in-situ water quality analysis with ultra-low power consumption and no manual calibration. Target markets: aquaculture (RAS), industrial water treatment, hydroponics.
ALCYON PHOTONICS
Alcyon Photonics develops integrated photonic building blocks and IP that enable high-performance, energy-efficient optical systems for AI, data communications, and sensing applications.
Belfort Labs
Belfort Labs is a KU Leuven COSIC spin-off building hardware acceleration for Fully Homomorphic Encryption (FHE). Our product roadmap centres on GPU acceleration today, with a custom ASIC on the 2028 roadmap. We make Encrypted Compute fast and practical so customers can process data while it stays encrypted, with no decryption and no exposure. Trust starts with the infrastructure.
Biio
We enable the next generation of intelligent physical systems – within wearables, robotics, defense, IoT or mobility. Biio is developing a physical intelligence platform, starting from a chip with a fully digital architecture that eliminates the data movement bottleneck. This delivers up to 100x lower power per inference while maintaining high accuracy.
Celtonn
Celtonn design and manufacture millimetre wave components, specialising in W-Band Systems for satellite link applications
Circuits Integrated
CIH is a fabless RF and microwave semiconductor company developing Kythrion, a 3D integrated antenna IC for flat-panel phased arrays. The solution combines transmit, receive and antenna functions using III-V and silicon technologies to reduce size, weight, power and cost for SATCOM, Earth observation, defense and high-frequency communications systems.
Comptek Solutions
Comptek Solutions develops advanced passivation and surface engineering technologies for compound semiconductor materials and devices. We provide customized surface treatment processes, technology transfer services, and manufacturing equipment. We also design tailored characterization tools based on advanced optical and spectroscopic methods to support process development and production.
Watch · The 2025 edition
Munich, 18 November 2025
Take part
Taking part through the aCCCess network
For Competence Centres and their start-ups
Eligibility. Start-ups affiliated with a European Chips Competence Centre, supported by the EIC or EuroCDP, in one of twelve technology domains: mainstream silicon, EDA & design automation, packaging & assembly, test & instrumentation, materials & substrates, process equipment, power electronics, MEMS & sensors, RF & mmWave, AI/ML hardware, silicon photonics, quantum technologies.
Applications. Competence Centres and the EIC share the application link with their start-ups. Applications for 2026 are closed; the call for the next edition will be sent to the network.
Participation. Selected start-ups attend Bordeaux and Munich free of charge (one participant per company). Competence Centre representatives attend CVF Selection free of charge; the full INPHO Venture Summit requires registration, at a dedicated rate for aCCCess members.
Investors and corporates
Meet the selected companies in Bordeaux and Munich, or join the jury alongside Europe's deeptech investors.
deeptech@blumorpho.comQuestions
Frequently asked questions
What is the Chips Venture Forum?
The Chips Venture Forum™ is an activity of the aCCCess programme dedicated to creating the conditions for investment in the European semiconductor ecosystem. It is operated by Blumorpho and organised with the support of the European Commission, within aCCCess, the European Innovation Council (EIC) and EuroCDP.
How can a start-up from a Chips Competence Centre take part?
Through its Competence Centre, which shares the application link. Start-ups supported by the EIC apply through the EIC. A jury of investors and industry experts selects the companies.
Which technologies are eligible?
Twelve domains: photonics, AI/ML hardware, MEMS and sensors, mainstream silicon technologies, RF and mmWave, quantum technologies, test and instrumentation equipment, process equipment and manufacturing tools, power electronics, materials and substrates, packaging and assembly, and EDA and design automation.
Is participation free for selected start-ups?
Yes. Each selected start-up attends the CVF Selection in Bordeaux and the CVF Final in Munich free of charge, for one participant.
When and where does the 2026 edition take place?
CVF Selection: 21–22 October 2026, Palais de la Bourse, Bordeaux, with 62 selected companies. CVF Final: 11 November 2026, Messe München, during SEMICON Europa.
Which organisations are involved in 2026?
Blumorpho operates the Forum with the support of the European Commission, within aCCCess and with the EIC. EuroCDP, the EU Chips Design Platform, is a partner of the 2026 edition.
Join us to shape Europe's semiconductor future
The Chips Venture Forum 2026 brings together the investors, start-ups, industry players and institutions that will shape the European semiconductor ecosystem for the next decade.
Operated by Blumorpho · Organised with the support of the European Commission, within aCCCess in partnership with EIC and EuroCDP
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.