Chips Think Tank #8 - Rethinking Advanced Packaging for Strategic Markets
Chips Think Tank Explores Advanced Packaging for Strategic Aerospace and Defence Applications
The latest edition of the aCCCess Chips Think Tank webinar series brought together semiconductor stakeholders to discuss how advanced packaging can support strategic markets where production volumes are limited but reliability requirements are exceptionally high.
The session featured Wilfrid Aklamavo, CTO of SERMA Microelectronics, in conversation with Régis Hamelin, CTO of Blumorpho and aCCCess Coordinator. Together, they explored the growing importance of advanced packaging technologies for aerospace and defence applications, sectors that operate in harsh environments and require highly robust, proven solutions.
During the webinar, participants gained insights into the specific technical and economic challenges associated with introducing advanced packaging into low- and medium-volume markets. The discussion highlighted the barriers that exist between laboratory innovation and industrial production, as well as the role of organisations such as SERMA in bridging this gap through the development of advanced packaging capabilities tailored to sovereign and strategic applications.
The speakers also addressed how European industry can strengthen its position in advanced packaging by building resilient capabilities that meet the unique demands of aerospace and defence while supporting technological sovereignty.
The session concluded with an engaging live Q&A, offering attendees the opportunity to discuss key challenges and future opportunities with industry experts. Through initiatives such as the Chips Think Tank series, aCCCess continues to foster dialogue between research, industry and innovation stakeholders, contributing to a stronger and more connected European semiconductor ecosystem.
Interested in exploring previous discussions? Recordings of earlier Chips Think Tank webinars are available on the aCCCess YouTube playlist: https://youtube.com/playlist?list=PLHAV8h5klxgHL9ccnTw54g6G5IqsFWQOP.
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.