APECS
APECS boosts European semiconductor leadership with a pilot line for advanced packaging and heterogeneous integration, offering SMEs, start-ups, and industry access to cutting-edge chiplet-based technologies and infrastructure.
The APECS Pilot Line is a European initiative advancing semiconductor innovation through advanced packaging and heterogeneous integration. APECS supports SMEs, start-ups, and major industry players with low-volume, high-value chip production, easing access to leading-edge technologies and infrastructure across Europe.
Spearheaded by Fraunhofer-Gesellschaft and a consortium of ten top institutions from eight EU countries, APECS provides a platform for chiplets, RF, opto, sensors, passives, and QMI technologies. It offers comprehensive services including System-Technology Co-Optimization (STCO), novel testing methodologies, CTR (Characterization, Test & Reliability), and holistic design environments (P/ADK).
The initiative aligns with the EU Chips Act and Chips for Europe Initiative, aiming to reduce Europe’s dependence on foreign supply chains, boost technological sovereignty, and enhance economic resilience. It strengthens cross-border collaboration, fosters knowledge transfer between RTOs, and develops sustainable pathways for talent acquisition in microelectronics.
Backed by both EU funding and national contributions—particularly from Germany’s BMFTR and several federal states—APECS is set to shape a robust, interconnected, and accessible European semiconductor ecosystem for the long term.
Technologies and Services
APECS provides diverse technologies on a single platform for advanced packaging and heterogeneous integration.
Demonstrators
The APECS pilot line showcases various demonstrators for chiplet innovations.
Chiplets and Components
Access to chiplets and components for semiconductor applications.
Access for Various Stakeholders
Low volume production of high value chips accessible for IDMs, chip foundries, research community, semiconductor customers, and start-ups.
Advanced Packaging
Expertise in advanced packaging techniques for electronic components.
Heterogeneous Integration
Specialization in heterogeneous integration of electronic systems.
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.