Chips Venture Forum
EVENT DETAILS
The Chips Venture Forum is a unique European competition dedicated to start-ups innovating across the semiconductor value chain. It offers semiconductor and deep-tech start-ups the chance to pitch in front of leading venture capital investors, corporates, and EU stakeholders during SEMICON Europe in Munich.
The Forum is part of the aCCCess project, coordinated in partnership with the European Innovation Council (EIC), EISMEA, and DG CONNECT. It's mission is to accelerate investment and collaboration in Europe's semiconductor ecosystem. This initiative is designed to strengthen Europes semiconductor sector in line with the EU Chips Act goals, helping ensure technological leadership and supply-chain resilience.
The registration to the final pitching event in Munich is open!
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.