Chips Think Tank#8: Rethinking Advanced Packaging for Strategic Markets

As part of the Chips Think Tank webinar series, we are pleased to invite you to a discussion on how advanced packaging can serve strategic markets where volumes are limited and reliability requirements are exceptionally high.

This session will feature Wilfrid Aklamavo, CTO of SERMA Microelectronics, one of Europes few OSATs primarily serving sovereign markets such as aerospace and defence. He will discuss with Regis Hamelin, Blumorpho CTO and aCCCess Coordinator.

Aerospace and defence applications operate in harsh environments and rely on highly robust, proven technologies.They increasingly need the integration capabilities of advanced packaging, a field historically shaped by high-volume economics. SERMA addresses this technological and economic challenge by bridging the lab-to-fab gap and developing advanced packaging capabilities for low- and medium-volume production.

During the webinar, the speakers will share insights on:

• the specific requirements of aerospace and defence applications,
• the challenges of introducing advanced packaging into lower-volume markets,
• the technological and economic barriers between lab and production,
• how European players can build advanced packaging capabilities for strategic and sovereign applications.

The session will close with a live Q&A with Wilfrid Aklamavo. By fostering dialogue between research, industry and innovation stakeholders, aCCCess supports the development of a strong, connected European semiconductor ecosystem.

-> The previous Chips Think Tank editions can be replayed here!