Advanced Packaging Workshop
EVENT DETAILS
The Advanced Packaging Workshop will bring together experts from across research and industry to explore key developments in chiplet integration, advanced substrates, interconnects, assembly, testing and manufacturing. It will also examine semiconductor policy, investment and supply chains, with a focus on accelerating innovation from research through to scalable manufacturing and commercial impact.
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.