/Submit your technological needs for Latvian Chip Competence Centre expert consultations

Submit your technological needs for Latvian Chip Competence Centre expert consultations

LCCCstartupSME
Submit your technological needs for Latvian Chip Competence Centre expert consultations

CALL DETAILS

DESCRIPTION

The Latvian Chip Competence Centre (LCCC) invites micro, small and medium-sized enterprises, including start-ups, to submit technological questions, ideas or challenges for expert consultations delivered in a workshop format in the field of chips and related advanced technologies. This is the next practical step following LCCCs informational webinars. The consultations will help companies discuss their technological needs, understand how they relate to LCCCs areas of expertise, and identify potential next steps and opportunities for future collaboration within the Latvian and European chip ecosystem. Workshop groups will be formed based on the interests indicated in the applications, including micro- and nanoelectronics, photonics, sensors, quantum technologies and materials science, as well as general guidance on modelling, simulation, measurement and characterisation approaches.

Participation in the consultations is free of charge for approved applicants. Applications will be evaluated based on eligibility, thematic relevance and available expert capacity. To apply, please complete the application form, sign it with a qualified electronic signature, and send it to services@latvianccc.lv.

All documents and detailed information are available under Open Calls

Please consult the available documents for detailed participation conditions, the application evaluation procedure, the scope of the consultations, and their limitations.

Expert consultations in a workshop format are planned for September 2026. Applications are open until further notice. LCCC reserves the right to close the call once the available expert capacity has been reached, or a sufficient number of applications has been received.

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aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.

Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.