aCCCess Webinar Series Technology Offers #1
The aCCCess Webinar Series on Technology Offers successfully launched with its first session dedicated to European Pilot Lines, featuring the APECS Pilot Line.
The webinar introduced participants to APECS (Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems), a key initiative under the EU Chips Act. The session highlighted APECS’ capabilities in advanced packaging, chiplet innovation, and system integration, as well as its role in bridging the gap between research and industrial deployment.
A particular focus was placed on collaboration within the European ecosystem, showcasing how APECS works together with the ChipNL Competence Centre to accelerate innovation, support industry uptake, and strengthen Europe’s semiconductor value chain. The session also included insights into user needs and experiences, underlining the importance of cooperation between pilot lines, competence centres, and industry actors.
▶️ Watch the webinar recording on YouTube
For more information about APECS, ChipNL, and other competence centres and pilot lines, visit:
https://www.acccess.eu/network
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.