FICCC

The Finnish Chips Competence Centre enhances semiconductor expertise, supporting industry innovation and collaboration within the European chip ecosystem.

The Finnish Chips Competence Centre (FiCCC) is a collaborative hub aimed at accelerating the digitalization of industries through advanced chip technology. It specializes in high-performance, energy-efficient system-on-chip design and complex manufacturing processes, including quantum technologies and wide band gap semiconductors. FiCCC offers technical expertise, experimentation, and support services, particularly benefiting SMEs and startups in the semiconductor sector. Targeting Finnish and European stakeholders, it connects them to a broader European ecosystem. The center is co-funded by ChipsJU and Business Finland, enhancing its partnerships across Europe to bolster the semiconductor industry's growth.

Services

Chip Development Support

Supports the development of chips that create a competitive advantage for various industries and increases the European demand for advanced chip technologies.

Access to EU Chips Design Platform

Provides Finnish companies and researchers access to the EU Chips Design Platform, facilitating collaboration and innovation.

Incubation Program

Offers the ChipStart EU program, a fully funded 12-month incubation program for early-stage semiconductor startups across the European Economic Area.

Trainings

Markus Pessa Summer School

An event focused on investing in the future of photonics and optoelectronics, engaging the next generation of scientists and innovators.

Chip Happens! Student Event

An event aimed at students to foster interest and innovation in chip technology.

Technical Capabilities

Microchip Design and Manufacturing

Expertise in microchip design, manufacturing, and business growth.

Research and Knowledge Mediation

Acts as a mediator between users and the latest research, knowledge, and piloting facilities.

EU Logo

aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.

Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.