Nordic Chip Meet-Up

Join us in Trondheim this September for the Nordic Chip Collaboration Meetup, a side event of the Trondheim Tech Festival, where industry and academia come together to shape the future of semiconductors in the Nordic countries.

Over two days (29-30 September), we will bring together key players from across the Nordics to share insights, collaborate, and explore new opportunities in chips, design, and advanced technologies. Building on the success of our previous events in Helsinki (2024) and Lund (2025), this gathering will unite stakeholders from across the Nordic and European chip ecosystem to strengthen partnerships and foster collaboration.

Programme

Day 1 will be located at DIGS, Krambugata 2, Trondheim and runs from 09:00 to approximately 16:30, followed by an optional networking dinner. Day 2 is a day of three site visits.

Please note that the afternoon sessions on Day 1 run as two parallel tracks you choose one session from each pair. Coffee breaks and lunch are included throughout the day. This is an indicative programme and may be subject to change.

Day 1 - 29 September

Location: DIGS, Krambugata 2, Trondheim Agenda

9:00 - 9:30 Registration, Coffee

9:30 - 10:15 Welcome address & Opening

• Welcome address: Steinar Brede, Nordic Chip Collaboration/Innovation Norway & Joonas Leppanen, Nordic Innovation
• Trondheim as a semiconductor hub: Speaker TBD
• EU/Global perspective, Chips Act 2.0: Zeno Tornasi, European Commission

10:15 - 11:30 Plenary session: Chips Design as a Nordic Stronghold

The Nordics have built a strong and globally competitive position in chip design across wireless, sensing, embedded systems, and advanced ASICs. This session highlights key strengths, success factors, and opportunities to further scale in a global landscape.

Confirmed speakers:

• Vegard Wollan, Nordic Semiconductor Chief Executive Officer / President
• Veijo Kontas, Wstcon Oy / FiCCC / Tamllink CEO & Senior Advisor
• Fredrik Tillman, Ericsson, Head of Integrated Radio Systems
• Moderator: Toni Mattila, Business Finland

11:30 - 12:30 Lunch break 12:30 - 14:00 Early afternoon Choose one of two parallel sessions

Session A: Behind the EU Chips Design Platform (EuroCDP)

EuroCDP aims to strengthen Europe's semiconductor design capacity by connecting design tools, IP, training, funding and access to fabrication and testing. The session explores platform vision, expected impact and how industry and research can engage.

Confirmed speakers:

• Romano Hoofman, Strategic Development Director, imec
• Vermund Bakken, CTO and Founder, Onio
• Elina Mielityinen, Chip Design Platform, FiCCC
• Moderator: Pier Paolo Aurino, Technology & Growth lead, Chalmers Industriteknik, SCCC

Session B: Chip Packaging & heterogeneous integration

Advanced packaging and heterogeneous integration enable higher system performance through chiplets, 3D integration and advanced ASIC packaging. This session explores technology trends and opportunities for the Nordics.

Confirmed speakers:

• Dr. Teresa Orellana Perez, Manager Business Development, APECS Pilot Line, Research Fab Microelectronics Germany (FMD)
• Alan Moghal, Advanced Packaging Area Manager, Intel Ireland
• Jari Arstila, Director, Murata Electronics
• Moderator: Feng-I Tai, Semiconductor Program Lead, Materials & Industrials, Business Sweden

14:00 - 14:30 Coffee break 14:30 - 16:00 Late afternoon Choose one of two parallel sessions

Session C: AI Workflows for Chip Design

As semiconductor design becomes more complex, AI is starting to support architecture, design, verification and optimization. This session explores practical examples of AI-enabled workflows and what they mean for future competitiveness.

Confirmed speakers:

• Kirill Bykov, Staff Engineer, Arm
• Jo Uthus, Executive VP, Nordic Semiconductor
• Frode Sundal, Associate Director, Microchip
• David Conochie. IC Optimize - CSO
• Moderator: Steinar Brede, Innovation Norway - Special Advisor

Session D: Talent Development & Attraction

Access to skilled talent is critical for strengthening the semiconductor ecosystem in an increasingly competitive global market. This session looks at how the Nordics can build and attract talent across the full value chain, from education and reskilling to international recruitment.

Confirmed speakers:

• Joachim Rodrigues, Lund University/ FAU (Friedrich-Alexander-Universitat)/ BCDC
• Carsten Wulff, NTNU / Nordic Semiconductor
• Pierre-Alexandre Bou-Ach, Technical Director, Arm
• Sofia Persson Bjork, Manager Sales and Operation, Qamcom
• Moderator: Sayani Majumdar, Tampere University - Associate Professor, Electrical Engineering

16:15 - 16:30 Closing session

The day will conclude with an optional networking dinner at Radisson Blu Royal Garden Hotel (Kjpmannsgata 73) at 19:00. Only for pre-registered attendees.

Day 2 - Wednesday 30 September

Day 2 of the Nordic Chip Collaboration event will offer participants the opportunity to experience the ecosystem first-hand through industry visits to Nordic Semiconductor, Arm Norway and Microchip. Participants will gain unique insights into leading Nordic companies and research environments, exploring how innovation in semiconductors is applied in practice and creating value across the semiconductor value chain.

Bus leaving from Radisson Blu Royal Garden Hotel (Kjpmannsgata 73) at 09:00

• Nordic Semiconductor
• Arm Norway
• Microchip

Bus returns to Radisson Blu Royal Garden Hotel at approximately 14:30 The programme may be subject to change and will be updated as further speakers are confirmed. Detailed timings will be shared with registered participants ahead of the event.

For any questions about the event, please contact the NCC team at info@nordicchipcollaboration.com.