FAMES technical Workshop - LID World Summit 2026
EVENT DETAILS
Semiconductor makers, startups, fabless companies and academic researchers will soon benefit from the pilot lines breakthroughs in high-performance, low-power chips.
Learn how you can adapt FAMES FD-SOI 10-and-7nm process technologies, embedded NVMs, 3D integration, RF components, and power-management IC solutions for your own innovations.
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.