/aCCCess Webinar on Technology Offers #1

aCCCess Webinar on Technology Offers #1

aCCCess Webinar on Technology Offers #1

EVENT DETAILS

  • May 12, 2026 10:00 CESTMay 12, 2026 11:00 CEST
  • Webinar
  • Event hosted byaCCCess

EVENT DETAILS

The aCCCess Webinar Series on Technology Offers

The webinar series will focus on technology offers of pilot lines, chips competence centres and beyond. On each webinar we will have one technology on spotlight and also focus on collaborations between ENCCC acteurs and user experiences.

Join us for the first webinar of the aCCCess series dedicated to European Pilot Lines. This session will spotlight the APECS Pilot Line, presenting its cutting-edge services in advanced packaging and heterogeneous integration. Discover how APECS collaborates with ChipNL Competence Centre to accelerate innovation, support industry uptake, and strengthen Europes semiconductor ecosystem.

About APECS Pilot Line

APECS (Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems) is a European pilot line under the EU Chips Act. It provides industry, SMEs, and research organisations with access to advanced packaging technologies, chiplet innovation, system integration, and pilot-scale manufacturingbridging the gap from research to industrial deployment.

About ChipNL Competence Centre

ChipNL is the Chips Competence Centre of the Netherlands, supporting innovation, collaboration, and access to semiconductor expertise and infrastructure.

For more information about APECS, ChipNL and other competence centres and pilot lines visit: https://www.acccess.eu/network

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aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.

Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.