HCHiP, Hungarys Chips Competence Centre, focuses on heterogeneous integration and packaging, supporting SMEs and industry with advanced micro- and nanotechnology expertise.
The Hungarian Centre for Heterogeneous Integration and Packaging (HCHiP) is Hungarys Chips Competence Centre within the European Network of Chips Competence Centres. Established by Bay Zoltan Nonprofit Ltd., the Budapest University of Technology and Economics, and the HUN-REN Centre for Energy Research, HCHiP strengthens national and European semiconductor value chains by combining research excellence with industrial application. The centre provides SMEs and industry partners with access to advanced micro- and nanotechnologies, material testing, and pilot production capacities, enabling the development of next-generation digital products with higher integration and added value. In addition to technology transfer, HCHiP fosters skills development across higher education, promotes awareness of semiconductor technologies, and supports innovation and business growth contributing directly to the strategic priorities of Hungary and the European Chips Act.
Provides access to domestic and European chip infrastructure, aligning with Hungarian and EU chip strategies.
Focuses on the development of domestic competencies and knowledge, particularly in heterogeneous integration.
Supports SMEs and companies in micro- and nanotechnologies.
Facilitates technology transfer from ideas to experimental production.
Engages domestic actors in international collaborations and connects with other European chip competence centers.
Addresses the shortage of professionals, including micro-certification based training.
Encourages access to the European Chip Fund.
Aims to improve the visibility and accessibility of competencies.
Training programs aimed at alleviating the shortage of professionals in the semiconductor industry.
Expertise in heterogeneous integration technologies.
Capabilities in micro- and nanotechnologies.
Expertise in facilitating technology transfer from concept to experimental production.

aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.