Webinar Introduction APECS Pilot Line by Fraunhofer/FMD
EVENT DETAILS
On 23 September from 10:00 to 11:00 CEST, we invite you to a webinar that provides a comprehensive overview of the APECS pilot line, developed to drive innovation in advanced packaging and heterogeneous system integration across Europe.
It will introduce the consortium of partners involved in APECS, present the key enabling technologies and explain how European companies and RTOs can access the pilot lines services and infrastructure.
This webinar is especially relevant for everyone active in the semiconductor domain; from chip design to assembly and test, from process development to equipment supply.
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.