Webinar | From Lab to Market: How APECS and ChipNL CC enable advanced packaging in Europe

Advanced packaging and heterogeneous integration play an increasingly important role in the further development of the European semiconductor industry. They make it possible to bring different technologies, functions, and components closer together, thus forming an important link between research, application, and market introduction.

On Tuesday, May 12, 2026, the webinar From Lab to Market: How APECS and ChipNL CC enable advanced packaging in Europe takes place. This online session is the first webinar in the aCCCess series on European Pilot Lines and focuses on the APECS Pilot Line.

During the webinar, participants will gain insight into APECS's technologies and services in the field of advanced packaging and heterogeneous integration. It will also be explained how APECS collaborates with Chips Competence Centres, including ChipNL Competence Centre, to better connect access to pilot lines with the needs of national ecosystems.

Programme

Introduction to the APECS Pilot Line technologies Erik Jung, Senior Business Developer APECS Pilot Line, Fraunhofer

APECS access strategies, collaboration with Chip Competence Centers, joint activities with ChipNL Felix Mohn, Manager Business Development, APECS Pilot Line, Research Fab Microelectronics Germany

ChipNLs perspective on the APECS Pilot Line: how ChipNL brings the pilot lines to the Dutch ecosystem Mark Luke Farrugia, Partnership Manager ChipTech Twente / ChipNL Competence Centre

Practical information

Date: Tuesday, May 12, 2026 Time: 10:00 AM 11:00 AM Location: online Cost: free Language: English

For whom?

This webinar is relevant for companies, knowledge institutions, and other organizations that want to learn more about advanced packaging, heterogeneous integration, and the possibilities of European pilot lines.