The 2026 IMAPS Nordic Microelectronics Packaging Conference and Exhibition (NordPac)
EVENT DETAILS
IMAPS Nordic welcomes you to the 2026 IMAPS Nordic Microelectronics Packaging Conference and Exhibition (NordPac) in Stockholm, Sweden. The event brings together academia and industry to explore the latest developments and future trends in microelectronics, packaging, and system integration.
As part of the conference, APECS will host a dedicated workshop:
APECS Workshop 10th of June at 15:00
The pilot line for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS), a key initiative of the EU Chips Act, is driving innovation in chiplet technologies and strengthening Europes semiconductor ecosystem.
This workshop will showcase APECS activities and expertise in the hardware integration of chiplet-based systems. Covering the full process chainfrom chiplet components to fully integrated systemsparticipants will gain insights into:
- 300 mm interposer technologies
- high-density substrates
- advanced assembly approaches
- key processes for heterointegration
The session will conclude with an introduction to LTCC (Low Temperature Co-fired Ceramic) technologies.
More information: https://nordic.imapseurope.org/workshops-nordpac-2026/
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.