/SINTEF's PiezoMEMS Platform Training

SINTEF's PiezoMEMS Platform Training

SINTEF's PiezoMEMS Platform Training

EVENT DETAILS

  • Jan 14, 2026 10:00 CETJan 15, 2026 16:30 CET
  • ImecLeuven, Belgium
  • Event hosted byCC-NorChip

EVENT DETAILS

This two-day training program provides participants with both a solid theoretical foundation and extensive hands-on practice in piezoMEMS technologies. The course is structured to gradually guide learners from fundamental principles to practical applications.

Day 1: participants are introduced to the core concepts of MEMS (Micro-Electro-Mechanical Systems), the science of piezoelectric materials, and the use of thin-film piezoelectrics in device fabrication. The sessions combine theory with illustrative examples, demonstrating how piezoMEMS devices are applied in areas such as sensing, actuation, and energy harvesting. In addition, the program offers a detailed overview of SINTEFs piezoMEMS process and the Europractice Multi-Project Batch (MPB) framework, which provides access to prototyping and fabrication services. This ensures that participants not only gain an understanding of how piezoMEMS function, but also how they can be realized through established industrial processes.

Day 2: is dedicated to practical, tool-based learning. Participants work directly with L-Edit design software and SINTEFs Process Design Kit (PDK) to create and refine piezoMEMS structures. Through guided exercises, they learn how to design cantilevers, membranes, and micromirrors, while also understanding the underlying process flows that connect design to fabrication. By engaging in these step-by-step design activities, participants gain experience with the challenges and considerations involved in translating conceptual device ideas into manufacturable layouts.

These lectures are suited for students pursuing STEM disciplines, and scientists or engineers who are interested in understanding and applying micro-electromechanical systems (MEMS) that leverage piezoelectric materials.

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aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.

Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.

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