Pre-Brokerage for Lab to Fab Accelerator projects on Advanced Packaging
EVENT DETAILS
EPoSS Association organises a workshop in conjunction with the EMPC 2025 | The 25th European Microelectronics & Packaging Conference (EMPC 2025). The workshop is also hosted by the EMPC 2025.
Chips JU is currently preparing the launch of two calls for Advanced Packaging. The goal of the workshop is to inform the community about the call content and to initiate consortia building.
The respective draft call https://www.chips-ju.europa.eu/CallDetails/?id=2af90e5b-d984-f011-b4cc-000d3ab33b4d has been published on September 2, 2025.
Please register here for the workshop: https://pretix.eu/eposs/LabToFab/. The workshop will take place onsite only.
EPoSS will be present at the meeting at their dedicated booth!
If you are not able to join, but you are interested in the calls and funding opportunities, you can contact the EPoSS Office via contact@smart-systems-integration.org.
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.