3rd APECS Roadshow: Norway
EVENT DETAILS
The Sensor Decade 2026 brings together leading voices from academia, industry and policy to explore the future of sensing technologies and their role in addressing global challenges across climate, health, industry and digital transformation.
As part of the program, APECS will contribute with a dedicated session:
APECS Session 4 June 2026 | 14:00
The pilot line for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS), a key initiative under the EU Chips Act, is driving innovation in chiplet technologies and strengthening Europes semiconductor ecosystem.
This session will present APECS activities and expertise in the integration of advanced electronic systems, with a focus on enabling technologies for next-generation sensing applications. Covering the full process chainfrom chiplet components to fully integrated systemsparticipants will gain insights into:
- advanced packaging approaches
- heterogeneous integration technologies
- high-density interconnects and substrates
- system integration for sensor and AI-driven applications
The session will highlight how APECS supports faster innovation cycles and facilitates access to cutting-edge infrastructure for industry, research and emerging players across Europe.
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.