2nd APECS EU-Roadshow: Finland
EVENT DETAILS
The pilot line for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS) is a central initiative within the EU Chips Act. It aims to accelerate innovation in chiplet technologies and strengthen Europes semiconductor research and manufacturing capabilities.
This workshop will highlight the activities of the APECS pilot line and its expertise in the hardware integration of chiplet-based systems. With access to individual chiplet components, the project partners are able to cover the entire process chain required to realize fully functional systems. Researchers are advancing state-of-the-art 300 mm interposer technologies, high-density substrates, advanced assembly approaches, and the key processes needed for the heterointegration of highly integrated electronic systems.
Contacts:
Dr. Christoph Kroh Research Fab Microelectronics Germany (FMD) E-Mail
Felix Mohn Research Fab Microelectronics Germany (FMD) E-Mail
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.