Building a stronger European semiconductor ecosystem with the European Network of Chips Competence Centers
About aCCCess
aCCCess (Alliance of Chips Competence Centres for Enhanced Semiconductor Services) is a four-year Coordination and Support Action launched in March 2025 under the EU Chips Act. It aims to build a strong, interconnected European Network of Chips Competence Centres (ENCCC) that enables innovation, facilitates access to advanced semiconductor services, and strengthens Europe’s position in the global semiconductor value chain.
Network
Our network is comprised of Chip Competence Centers, Pilot lines and Design Platforms. Together, PLs and the DP empower the CCCs with cutting-edge infrastructure.
What is a Competence Center?
A Chips Competence Centre (CCC) is a hub of excellence providing access to specialised semiconductor knowledge, training, prototyping, testing, and small-scale production. These centres are pivotal to Europe's semiconductor strategy by:
- Supporting SMEs and start-ups with innovation services
- Bridging the gap between research and industry
- Promoting regional and pan-European know-how in chips and microelectronics
What is a Pilot Line & a Design Platform?
Pilot Lines (PLs) are advanced manufacturing facilities that help scale innovations from research to production, enabling validation in relevant environments.
The Design Platform (DP) is a cloud-based virtual environment providing state-of-the-art Electronic Design Automation (EDA) tools and design libraries to:
- Accelerate chip design and prototyping
- Enable collaboration across Europe
- Support education and skills development in semiconductor design
Latest News
Chips Venture Forum
Are you building the future of semiconductors, AI-powered systems, advanced materials, or edge computing? Benefit from the strengths of Competence Centres across Europe by joining a vibrant ecosystem of innovators and key stakeholders. This is your chance to accelerate your ideas and connect with experts in the semiconductor value chain....
Greek chips at the heart of innovation
Launched on 1 June 2025, the Hellenic Chips Competence Centre (HCCC) is Greece’s first semiconductor hub, established through a partnership between HETiA, the Ministry of Development, and the European Chips Joint Undertaking. With €7 million in funding, HCCC aims to strengthen Europe’s technological autonomy by supporting innovation, research, start-ups, and...
Enhancing chip performance
The European semiconductor sector is experiencing significant growth, fueled by increasing investments in research and development. Companies are focusing on enhancing chip performance and energy efficiency to meet the needs of various industries....
Open Calls
Join the 2D-PL Multi-Project Wafer Runs! | SCCC
Opens:07:00 CET
Closes:16:00 CET
The 2D Pilot Line (2D-PL) part of the Graphene Flagship and a key pilot line within the Swedish Chips Competence Centre (SCCC) is now accepting applications for upcoming multi-project wafer (MPW) runs!
Please note: Each MPW run has its own deadline, so make sure to stay updated and submit your application in time!
Open Access to FAMES Pilot Line
Opens:23:00 CET
Closes:22:59 CET
The FAMES Pilot Line accepts Spontaneous User Requests year-round, offering organisations rapid access to its advanced semiconductor technologies outside the annual Open-Access Calls. This pathway enables time-critical projects to move forward without waiting for the next call.
Events
Discover CSC
13:00 CET16:00 CET
OnlineTeams
Czech Semiconductor Centre (CSC) is organising an online introduction event about the services of CSC, pilot lines and design platform. ### Programme: 1:00 p.m. 1:30 p.m. Introduction to CSC (Karel Masarik, Director) 1:30 p.m. 2:00 p.m. Introduction to the FAMES pilot line (Dominique Noguet, PhD; FAMES Pilot Line Project Coordinator;...
Event hosted by
Pre-Brokerage for Lab to Fab Accelerator projects on Advanced Packaging
15:30 CEST17:30 CEST
World Trade Center GrenobleGrenoble
EPoSS Association organises a workshop in conjunction with the EMPC 2025 | The 25th European Microelectronics & Packaging Conference (EMPC 2025). The workshop is also hosted by the EMPC 2025. **Chips JU** is currently preparing the launch of two calls for Advanced Packaging. The goal of the workshop is to...
Event hosted by
Webinar Introduction APECS Pilot Line by Fraunhofer/FMD
10:00 CEST11:00 CEST
Online
On 23 September from 10:00 to 11:00 CEST, we invite you to a webinar that provides a comprehensive overview of the APECS pilot line, developed to drive innovation in advanced packaging and heterogeneous system integration across Europe. It will introduce the consortium of partners involved in APECS, present the key...
Event hosted by
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aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.